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Bending-resistant high-thermal-conductivity artificial graphite film, preparation method and application
The invention belongs to the technical field of polyimide film materials, and particularly relates to a bending-resistant high-thermal-conductivity artificial graphite film, a preparation method and application. The bending-resistant high-thermal-conductivity artificial graphite film is prepared from the following raw materials in parts by weight: 100 parts of benzimidazolyl polyamide acid resin, 1-10 parts of chopped polyimide fibers and 0.3-1 part of an inorganic auxiliary agent, the viscosity of the benzimidazole-based polyamide acid resin is 50-150 Pa.s, the benzimidazole-based polyamide acid resin is obtained by carrying out polycondensation on diamine and dianhydride in an aprotic strong polar solvent, and the molar ratio of the diamine to the dianhydride is 1: (0.98-1.011); the diamine is one or more of benzimidazole diamines shown in formulas I-1 to I-4. According to the invention, benzimidazole diamine is adopted as one of diamine monomers and reacts with a dianhydride monomer to synthesize the benzimidazolyl polyimide film with a block structure, and the introduction of a benzimidazole unit with a rigid rodlike structure realizes the strong combination of rigid and straight benzoxazole heteroaromatic ring and a five-membered imide ring.
本发明属于聚酰亚胺薄膜材料技术领域，具体涉及一种耐弯折高导热人工石墨膜、制备方法及应用；所述耐弯折高导热人工石墨膜的制备原料包括：苯并咪唑基聚酰胺酸树脂100份，短切聚酰亚胺纤维1～10份，无机助剂0.3～1份；所述苯并咪唑基聚酰胺酸树脂的黏度为50～150Pa·s，所述苯并咪唑基聚酰胺酸树脂是由二胺、二酐在非质子强极性溶剂中缩聚所得，所述二胺、二酐摩尔比为1:0.98～1.011；所述二胺为式I‑1～I‑4苯并咪唑二胺中的一种或多种。本发明采用苯并咪唑类二胺作为二胺单体之一，与二酐单体反应，合成具有嵌段结构的苯并咪唑基聚酰亚胺薄膜，刚性棒状结构的苯并咪唑单元的引入，实现了刚直性苯并唑芳香杂环与五元酰亚胺环的“强强联合”。
Bending-resistant high-thermal-conductivity artificial graphite film, preparation method and application
The invention belongs to the technical field of polyimide film materials, and particularly relates to a bending-resistant high-thermal-conductivity artificial graphite film, a preparation method and application. The bending-resistant high-thermal-conductivity artificial graphite film is prepared from the following raw materials in parts by weight: 100 parts of benzimidazolyl polyamide acid resin, 1-10 parts of chopped polyimide fibers and 0.3-1 part of an inorganic auxiliary agent, the viscosity of the benzimidazole-based polyamide acid resin is 50-150 Pa.s, the benzimidazole-based polyamide acid resin is obtained by carrying out polycondensation on diamine and dianhydride in an aprotic strong polar solvent, and the molar ratio of the diamine to the dianhydride is 1: (0.98-1.011); the diamine is one or more of benzimidazole diamines shown in formulas I-1 to I-4. According to the invention, benzimidazole diamine is adopted as one of diamine monomers and reacts with a dianhydride monomer to synthesize the benzimidazolyl polyimide film with a block structure, and the introduction of a benzimidazole unit with a rigid rodlike structure realizes the strong combination of rigid and straight benzoxazole heteroaromatic ring and a five-membered imide ring.
本发明属于聚酰亚胺薄膜材料技术领域，具体涉及一种耐弯折高导热人工石墨膜、制备方法及应用；所述耐弯折高导热人工石墨膜的制备原料包括：苯并咪唑基聚酰胺酸树脂100份，短切聚酰亚胺纤维1～10份，无机助剂0.3～1份；所述苯并咪唑基聚酰胺酸树脂的黏度为50～150Pa·s，所述苯并咪唑基聚酰胺酸树脂是由二胺、二酐在非质子强极性溶剂中缩聚所得，所述二胺、二酐摩尔比为1:0.98～1.011；所述二胺为式I‑1～I‑4苯并咪唑二胺中的一种或多种。本发明采用苯并咪唑类二胺作为二胺单体之一，与二酐单体反应，合成具有嵌段结构的苯并咪唑基聚酰亚胺薄膜，刚性棒状结构的苯并咪唑单元的引入，实现了刚直性苯并唑芳香杂环与五元酰亚胺环的“强强联合”。
Bending-resistant high-thermal-conductivity artificial graphite film, preparation method and application
一种耐弯折高导热人工石墨膜、制备方法及应用
PAN CHENG (author) / SHI ENTAI (author) / HU CHENGPENG (author) / YANG JINGHONG (author)
2024-10-29
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
/
C08G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
,
Makromolekulare Verbindungen, anders erhalten als durch Reaktionen, an denen nur ungesättigte Kohlenstoff-Kohlenstoff-Bindungen beteiligt sind
/
C08J
Verarbeitung
,
WORKING-UP
/
C08K
Verwendung von anorganischen oder nichtmakromolekularen organischen Stoffen als Zusatzstoffe
,
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
/
C08L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
,
Massen auf Basis makromolekularer Verbindungen
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