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Method for preparing metalized ceramic substrate through high-temperature co-firing
The invention relates to the technical field of ceramic metallization, in particular to a method for preparing a metallized ceramic substrate through high-temperature co-firing, which comprises the following steps: firstly, performing composite metal ion implantation treatment on a ceramic substrate, then preparing metallized slurry containing polyvinyl butyral modified phenolic resin, and finally preparing the metallized ceramic substrate through high-temperature co-firing. The preparation method comprises the following steps: printing or coating the metallization slurry on the surface of a ceramic substrate, drying to obtain a metallization layer, and finally heating, discharging glue, and co-firing at high temperature to obtain the metallization ceramic substrate. The method has wide application prospects in the fields of LED heat dissipation substrates, ceramic packaging, electronic circuit substrates, semiconductor packaging and the like.
本发明涉及陶瓷金属化技术领域，具体为一种高温共烧制备金属化陶瓷基片的方法，先对陶瓷基片进行复合金属离子注入处理，再制备含聚乙烯醇缩丁醛改性酚醛树脂的金属化浆料，将所述金属化浆料印刷或者涂覆在所述陶瓷基片的表面，烘干得到金属化层，最后升温排胶、高温共烧即可，本发明所制备金属化陶瓷基片的金属化层的抗拉强度较高，在LED散热基板、陶瓷封装、电子电路基板、半导体封装等领域具有广泛的应用前景。
Method for preparing metalized ceramic substrate through high-temperature co-firing
The invention relates to the technical field of ceramic metallization, in particular to a method for preparing a metallized ceramic substrate through high-temperature co-firing, which comprises the following steps: firstly, performing composite metal ion implantation treatment on a ceramic substrate, then preparing metallized slurry containing polyvinyl butyral modified phenolic resin, and finally preparing the metallized ceramic substrate through high-temperature co-firing. The preparation method comprises the following steps: printing or coating the metallization slurry on the surface of a ceramic substrate, drying to obtain a metallization layer, and finally heating, discharging glue, and co-firing at high temperature to obtain the metallization ceramic substrate. The method has wide application prospects in the fields of LED heat dissipation substrates, ceramic packaging, electronic circuit substrates, semiconductor packaging and the like.
本发明涉及陶瓷金属化技术领域，具体为一种高温共烧制备金属化陶瓷基片的方法，先对陶瓷基片进行复合金属离子注入处理，再制备含聚乙烯醇缩丁醛改性酚醛树脂的金属化浆料，将所述金属化浆料印刷或者涂覆在所述陶瓷基片的表面，烘干得到金属化层，最后升温排胶、高温共烧即可，本发明所制备金属化陶瓷基片的金属化层的抗拉强度较高，在LED散热基板、陶瓷封装、电子电路基板、半导体封装等领域具有广泛的应用前景。
Method for preparing metalized ceramic substrate through high-temperature co-firing
一种高温共烧制备金属化陶瓷基片的方法
CAO JIANHUI (author) / CAO JIANPING (author) / TAN YANFEI (author) / LIU PING (author) / QING BAOTAO (author)
2024-10-29
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
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