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Metalized ceramic plate and preparation method thereof
The invention discloses a metalized ceramic plate and a preparation method thereof. The metalized ceramic plate includes: a ceramic substrate; and a metal conductive layer arranged on one side of the ceramic substrate and used for realizing the conductivity of the metalized ceramic plate. The ceramic substrate is adopted as a supporting structure of the whole metalized ceramic plate. As the rigidity of ceramic is larger than that of metal, the rigidity of the whole metalized ceramic plate can be improved, and the service life of the whole metalized ceramic plate can be prolonged. As the weight of ceramic is smaller than that of metal, the weight of the whole metalized ceramic plate can be reduced. Electric signals are transmitted through the metal conductive layer, so that the conductivity of the metalized ceramic plate can be realized. Compared with a traditional metal plate, the metalized ceramic plate has ensured conductivity, improved rigidity, prolonged service life and reduced weight, and thus can be designed to be light.
本申请公开了一种金属化陶瓷板及其制备方法。该金属化陶瓷板包括：陶瓷基板；金属导电层，设置在陶瓷基板的一侧，用于实现金属化陶瓷板的导电性。本申请采用陶瓷基板作为整个金属化陶瓷板的支撑结构，因陶瓷的刚性大于金属的刚性，因此能够提高整个金属化陶瓷板的刚性，增加其寿命，且因陶瓷的重量小于金属的重量，因此能够减小整个金属化陶瓷板的重量；且本申请通过金属导电层传输电信号，能够实现金属化陶瓷板的导电性。与传统的金属板比较，本申请金属化陶瓷板能够保证导电性能，且能够提高刚性，延长寿命，还能缩小重量，便于其轻便化设计。
Metalized ceramic plate and preparation method thereof
The invention discloses a metalized ceramic plate and a preparation method thereof. The metalized ceramic plate includes: a ceramic substrate; and a metal conductive layer arranged on one side of the ceramic substrate and used for realizing the conductivity of the metalized ceramic plate. The ceramic substrate is adopted as a supporting structure of the whole metalized ceramic plate. As the rigidity of ceramic is larger than that of metal, the rigidity of the whole metalized ceramic plate can be improved, and the service life of the whole metalized ceramic plate can be prolonged. As the weight of ceramic is smaller than that of metal, the weight of the whole metalized ceramic plate can be reduced. Electric signals are transmitted through the metal conductive layer, so that the conductivity of the metalized ceramic plate can be realized. Compared with a traditional metal plate, the metalized ceramic plate has ensured conductivity, improved rigidity, prolonged service life and reduced weight, and thus can be designed to be light.
本申请公开了一种金属化陶瓷板及其制备方法。该金属化陶瓷板包括：陶瓷基板；金属导电层，设置在陶瓷基板的一侧，用于实现金属化陶瓷板的导电性。本申请采用陶瓷基板作为整个金属化陶瓷板的支撑结构，因陶瓷的刚性大于金属的刚性，因此能够提高整个金属化陶瓷板的刚性，增加其寿命，且因陶瓷的重量小于金属的重量，因此能够减小整个金属化陶瓷板的重量；且本申请通过金属导电层传输电信号，能够实现金属化陶瓷板的导电性。与传统的金属板比较，本申请金属化陶瓷板能够保证导电性能，且能够提高刚性，延长寿命，还能缩小重量，便于其轻便化设计。
Metalized ceramic plate and preparation method thereof
一种金属化陶瓷板及其制备方法
LIN FANGTING (author) / ZHAO AN (author) / ZHANG KAI (author) / HU HAN (author)
2021-11-30
Patent
Electronic Resource
Chinese
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