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Microporous low-thermal-conductivity composite silica brick and preparation method thereof
The invention discloses a microporous low-thermal-conductivity composite silica brick and a preparation method thereof, and belongs to the technical field of composite silica bricks, a thermal insulation layer of the composite silica brick is prepared from the following components in percentage by mass: 65%-75% of a poly (light porous) siliceous homogenized material, 20%-25% of quartz powder, 2%-8% of silica powder, 0.1%-1% of sodium tripolyphosphate and the balance of water. The high-strength porous material formed by combining 0.05%-0.3% of sodium hexametaphosphate and 1%-2% of a binding agent II has the characteristics of high strength, low heat conductivity coefficient, good strength and heat preservation effect, energy conservation and consumption reduction; the working layer of the composite silica brick has the high strength of a traditional silica brick, is in direct contact with high-temperature materials, has the excellent performance of high-temperature wear resistance, high refractoriness under load, erosion resistance and thermal shock resistance, and achieves the use effect of stability and long service life. According to the invention, the high strength and thermal insulation effect of the composite silica brick are realized, and the energy-saving effects of synchronous molding, synchronous sintering, high temperature resistance and thermal insulation are realized.
本发明公开了一种微孔低导热复合硅砖及其制备方法，属于复合硅砖技术领域，本发明复合硅砖的保温层是由质量百分比为65％～75％聚轻微孔硅质均化料，20％～25％石英粉、2％～8％硅微粉，0.1％～1％三聚磷酸钠，0.05％～0.3％六偏磷酸钠和1％～2％结合剂Ⅱ组合形成的高强多孔材料，具备强度高、导热系数低、强度和保温效果好、节能降耗的特点；复合硅砖的工作层具有传统硅砖的高强度，直接接触高温物料，具有高温耐磨，高荷重软化温度，抗侵蚀，抗热震的优越性能，达到稳定长寿的使用效果。本发明实现了复合硅砖的高强和保温效果，同时实现了同步成型，同步烧成，既耐高温又能保温的节能效果。
Microporous low-thermal-conductivity composite silica brick and preparation method thereof
The invention discloses a microporous low-thermal-conductivity composite silica brick and a preparation method thereof, and belongs to the technical field of composite silica bricks, a thermal insulation layer of the composite silica brick is prepared from the following components in percentage by mass: 65%-75% of a poly (light porous) siliceous homogenized material, 20%-25% of quartz powder, 2%-8% of silica powder, 0.1%-1% of sodium tripolyphosphate and the balance of water. The high-strength porous material formed by combining 0.05%-0.3% of sodium hexametaphosphate and 1%-2% of a binding agent II has the characteristics of high strength, low heat conductivity coefficient, good strength and heat preservation effect, energy conservation and consumption reduction; the working layer of the composite silica brick has the high strength of a traditional silica brick, is in direct contact with high-temperature materials, has the excellent performance of high-temperature wear resistance, high refractoriness under load, erosion resistance and thermal shock resistance, and achieves the use effect of stability and long service life. According to the invention, the high strength and thermal insulation effect of the composite silica brick are realized, and the energy-saving effects of synchronous molding, synchronous sintering, high temperature resistance and thermal insulation are realized.
本发明公开了一种微孔低导热复合硅砖及其制备方法，属于复合硅砖技术领域，本发明复合硅砖的保温层是由质量百分比为65％～75％聚轻微孔硅质均化料，20％～25％石英粉、2％～8％硅微粉，0.1％～1％三聚磷酸钠，0.05％～0.3％六偏磷酸钠和1％～2％结合剂Ⅱ组合形成的高强多孔材料，具备强度高、导热系数低、强度和保温效果好、节能降耗的特点；复合硅砖的工作层具有传统硅砖的高强度，直接接触高温物料，具有高温耐磨，高荷重软化温度，抗侵蚀，抗热震的优越性能，达到稳定长寿的使用效果。本发明实现了复合硅砖的高强和保温效果，同时实现了同步成型，同步烧成，既耐高温又能保温的节能效果。
Microporous low-thermal-conductivity composite silica brick and preparation method thereof
一种微孔低导热复合硅砖及其制备方法
FAN HAIQIANG (author) / ZHANG WEIMIN (author) / XIA ZHONGFENG (author) / YIN YUCHENG (author) / LI YIWEI (author) / ZHU QINGYOU (author) / LIU ZHIQIANG (author)
2024-11-22
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
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