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Novel ceramic production process
The invention belongs to the technical field of ceramic production, and particularly relates to a novel ceramic production process which comprises the following specific steps: S1, firstly, selecting a ceramic base material with a proper size and shape, pretreating the ceramic base material, and directly coating conductive slurry on the ceramic base body by adopting a silk-screen printing mode; s2, performing laser pattern cutting on the oxygen-free copper to obtain a required circuit pattern made of an oxygen-free copper material; s3, attaching and combining the circuit pattern cut from the oxygen-free copper and the ceramic substrate coated with the conductive slurry, putting the circuit pattern and the ceramic substrate into a vacuum sintering furnace together, and performing high-temperature sintering on the circuit pattern and the ceramic substrate; the cut oxygen-free copper is attached to the surface of the ceramic base material, the ceramic base material is subjected to vacuum sintering processing, and then the ceramic base material is treated in an etching mode, so that compared with a traditional production process, the novel ceramic production process is more time-saving, and meanwhile, the pattern accuracy is higher.
本发明属于陶瓷生产技术领域,具体的说是一种新型的陶瓷生产工艺,该生产工艺具体步骤如下,S1:首先选取合适大小形状的陶瓷基材,对陶瓷基材进行预处理后,采用丝网印刷的方式在将导电浆料直接涂布在陶瓷基体上;S2:对无氧铜进行激光图形切割,得到所需的无氧铜材质的线路图形;S3:将无氧铜切割出的线路图形与涂布有导电浆料的陶瓷基材贴附合并后,一同放入真空烧结炉中,对线路图形与陶瓷基材进行高温烧结;通过采用将切割出的无氧铜贴附在陶瓷基材表面,并对陶瓷基材进行真空烧结加工,之后通过蚀刻的方式对陶瓷基材进行处理,可使得新型的陶瓷生产工艺相较于传统的生产工艺更加省时,同时图形精确度更高。
Novel ceramic production process
The invention belongs to the technical field of ceramic production, and particularly relates to a novel ceramic production process which comprises the following specific steps: S1, firstly, selecting a ceramic base material with a proper size and shape, pretreating the ceramic base material, and directly coating conductive slurry on the ceramic base body by adopting a silk-screen printing mode; s2, performing laser pattern cutting on the oxygen-free copper to obtain a required circuit pattern made of an oxygen-free copper material; s3, attaching and combining the circuit pattern cut from the oxygen-free copper and the ceramic substrate coated with the conductive slurry, putting the circuit pattern and the ceramic substrate into a vacuum sintering furnace together, and performing high-temperature sintering on the circuit pattern and the ceramic substrate; the cut oxygen-free copper is attached to the surface of the ceramic base material, the ceramic base material is subjected to vacuum sintering processing, and then the ceramic base material is treated in an etching mode, so that compared with a traditional production process, the novel ceramic production process is more time-saving, and meanwhile, the pattern accuracy is higher.
本发明属于陶瓷生产技术领域,具体的说是一种新型的陶瓷生产工艺,该生产工艺具体步骤如下,S1:首先选取合适大小形状的陶瓷基材,对陶瓷基材进行预处理后,采用丝网印刷的方式在将导电浆料直接涂布在陶瓷基体上;S2:对无氧铜进行激光图形切割,得到所需的无氧铜材质的线路图形;S3:将无氧铜切割出的线路图形与涂布有导电浆料的陶瓷基材贴附合并后,一同放入真空烧结炉中,对线路图形与陶瓷基材进行高温烧结;通过采用将切割出的无氧铜贴附在陶瓷基材表面,并对陶瓷基材进行真空烧结加工,之后通过蚀刻的方式对陶瓷基材进行处理,可使得新型的陶瓷生产工艺相较于传统的生产工艺更加省时,同时图形精确度更高。
Novel ceramic production process
一种新型的陶瓷生产工艺
XU CHAOCHEN (author) / ZHONG SHAOYING (author) / ZHONG HONGFENG (author)
2024-11-22
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
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