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Copper embossment and processing technology thereof
The invention discloses a copper embossment and a processing technology thereof. The copper embossment prepared by the invention is good in plasticity and convenient to form; the acrylic resin and the sodium silicate solution are used as sizing materials, so that the overall structure of the product is harder and firmer, and the product is not prone to deformation and cracking under natural conditions; the carboxymethyl chitosan is modified, the spatial network structure of carboxymethyl chitosan molecules is increased, amino in guanidine sulfamate carries positive charges, sodium polyphosphate carries negative charges, the crosslinking degree of a reaction system is improved through electrostatic interaction, and then the bonding strength and water resistance of the adhesive are improved; meanwhile, added zinc ions can be coordinated with amino in guanidine sulfamate to form a coordination compound, and molecular chains in a net structure are connected through coordination bonds, so that the crosslinking density is further increased, water swelling can be effectively prevented, and the bonding strength and water resistance of the adhesive are further improved.
本发明公开了一种铜浮雕及其加工工艺,本发明所制备得到的铜浮雕可塑性能好,成型方便;本发明以丙烯酸树脂和硅酸钠溶液两种成分作为胶料,使得产品的整体结构更加坚硬和牢固,在自然条件下不易变形和开裂;本发明通过对羧甲基壳聚糖进行改性处理,增加了羧甲基壳聚糖分子的空间网络结构,同时氨基磺酸胍中的氨基带正电荷,多聚磷酸钠带负电荷,通过静电作用,提高了反应体系的交联程度,进而提高了胶黏剂的胶合强度和耐水性能;同时,加入的锌离子能够与氨基磺酸胍中的氨基配位形成配位化合物,网状结构中的分子链通过配位键连接,进一步增加了交联密度,能够有效防止水分溶胀,进一步提高了胶黏剂的胶合强度和耐水性能。
Copper embossment and processing technology thereof
The invention discloses a copper embossment and a processing technology thereof. The copper embossment prepared by the invention is good in plasticity and convenient to form; the acrylic resin and the sodium silicate solution are used as sizing materials, so that the overall structure of the product is harder and firmer, and the product is not prone to deformation and cracking under natural conditions; the carboxymethyl chitosan is modified, the spatial network structure of carboxymethyl chitosan molecules is increased, amino in guanidine sulfamate carries positive charges, sodium polyphosphate carries negative charges, the crosslinking degree of a reaction system is improved through electrostatic interaction, and then the bonding strength and water resistance of the adhesive are improved; meanwhile, added zinc ions can be coordinated with amino in guanidine sulfamate to form a coordination compound, and molecular chains in a net structure are connected through coordination bonds, so that the crosslinking density is further increased, water swelling can be effectively prevented, and the bonding strength and water resistance of the adhesive are further improved.
本发明公开了一种铜浮雕及其加工工艺,本发明所制备得到的铜浮雕可塑性能好,成型方便;本发明以丙烯酸树脂和硅酸钠溶液两种成分作为胶料,使得产品的整体结构更加坚硬和牢固,在自然条件下不易变形和开裂;本发明通过对羧甲基壳聚糖进行改性处理,增加了羧甲基壳聚糖分子的空间网络结构,同时氨基磺酸胍中的氨基带正电荷,多聚磷酸钠带负电荷,通过静电作用,提高了反应体系的交联程度,进而提高了胶黏剂的胶合强度和耐水性能;同时,加入的锌离子能够与氨基磺酸胍中的氨基配位形成配位化合物,网状结构中的分子链通过配位键连接,进一步增加了交联密度,能够有效防止水分溶胀,进一步提高了胶黏剂的胶合强度和耐水性能。
Copper embossment and processing technology thereof
一种铜浮雕及其加工工艺
ZHANG XINGSHENG (author)
2024-11-26
Patent
Electronic Resource
Chinese
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