A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Silicon nitride ceramic substrate and silicon nitride ceramic circuit board using the substrate
The present invention provides a silicon nitride ceramic substrate composed of a silicon nitride sintered body in which maximum size of pore existing in grain boundary phase of the sintered body is 0.3 mu m or less, and having a thermal conductivity of 50W/mK or more and a three point bending strength of 500MPa or more, wherein a leak current is 1000nA or less when an alternative voltage of 1.5kV-100Hz is applied to a portion between front and back surfaces of the silicon nitride sintered body under conditions of a temperature of 25 DEG C and a relative humidity of 70%. According to the above structure of the present invention, there can be provided a silicon nitride ceramic substrate capable of effectively suppressing a leak current generation when the above substrate is assembled into various power modules and circuit boards, and capable of greatly improving insulating property and operative reliability of power modules in which output power and capacity are greatly increased.
Silicon nitride ceramic substrate and silicon nitride ceramic circuit board using the substrate
The present invention provides a silicon nitride ceramic substrate composed of a silicon nitride sintered body in which maximum size of pore existing in grain boundary phase of the sintered body is 0.3 mu m or less, and having a thermal conductivity of 50W/mK or more and a three point bending strength of 500MPa or more, wherein a leak current is 1000nA or less when an alternative voltage of 1.5kV-100Hz is applied to a portion between front and back surfaces of the silicon nitride sintered body under conditions of a temperature of 25 DEG C and a relative humidity of 70%. According to the above structure of the present invention, there can be provided a silicon nitride ceramic substrate capable of effectively suppressing a leak current generation when the above substrate is assembled into various power modules and circuit boards, and capable of greatly improving insulating property and operative reliability of power modules in which output power and capacity are greatly increased.
Silicon nitride ceramic substrate and silicon nitride ceramic circuit board using the substrate
Keramiksubstrat aus Siliziumnitrid und das Substrat verwendende keramische Schaltkreisplatte
Substrat en nitrure de silicium et plaquette de circuit ceramique utilisant le substrat
KOMATSU MICHIYASU (author) / YAMAGUCHI HARUHIKO (author) / NABA TAKAYUKI (author) / YAMAGUCHI HIDEKI (author)
2016-08-31
Patent
Electronic Resource
English
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