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Method for producing a metal/ceramic bonding substrate
In a metal/ceramic bonding substrate 10 wherein a circuit forming metal plate 14 is bonded to one side of a ceramic substrate 12 and a radiating metal base plate 16 is bonded to the other side thereof, a difference in level is provided along the entire circumference of the bonding surface of the ceramic substrate 12 to the metal base plate 16. The difference in level is provided by forming at least one of a rising portion 16a and a groove portion 116b on and in the metal base plate 16.
Method for producing a metal/ceramic bonding substrate
In a metal/ceramic bonding substrate 10 wherein a circuit forming metal plate 14 is bonded to one side of a ceramic substrate 12 and a radiating metal base plate 16 is bonded to the other side thereof, a difference in level is provided along the entire circumference of the bonding surface of the ceramic substrate 12 to the metal base plate 16. The difference in level is provided by forming at least one of a rising portion 16a and a groove portion 116b on and in the metal base plate 16.
Method for producing a metal/ceramic bonding substrate
Herstellungsverfahren für ein Metall/Keramik-Verbundsubstrat
Procédé de fabrication d'un substrat composite métal/céramique
OSANAI HIDEYO (author) / TAKAHASHI TAKAYUKI (author) / NAMIOKA MAKOTO (author)
2020-03-18
Patent
Electronic Resource
English
IPC:
B22D
CASTING OF METALS
,
Gießen von Metallen
/
C04B
Kalk
,
LIME
/
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
/
C23F
Nichtmechanisches Entfernen metallischer Stoffe von Oberflächen
,
NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES
/
H05K
PRINTED CIRCUITS
,
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