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A platform for research: civil engineering, architecture and urbanism
METHOD FOR MANUFACTURING METAL-CERAMIC BONDING SUBSTRATE, AND METAL-CERAMIC BONDING SUBSTRATE
To provide a technique capable of suppressing the occurrence of minute defects in a nickel plating film.SOLUTION: A method for manufacturing a metal-ceramic bonding substrate includes the steps of: bonding a metal plate, on at least one main surface of a ceramic substrate, through a brazing material containing silver and having a lead concentration of X ppm (X≤50); and using an electroless nickel plating solution with a lead concentration of Y mg/L to form a nickel plating film on the surfaces of the metal plate and the brazing material. In the step of forming a nickel plating film, a lead concentration Y in the electroless nickel plating solution is adjusted to satisfy a relationship of 0.05≤Y≤-0.002X+0.5.SELECTED DRAWING: Figure 1
【課題】ニッケルめっき被膜の微細な欠陥の発生を抑制することができる技術を提供する。【解決手段】セラミックス基板の少なくとも一方の主面上に、銀を含み、かつ、鉛の濃度がＸｐｐｍ（Ｘ≦５０）であるろう材を介して金属板を接合する工程と、鉛の濃度がＹｍｇ／Ｌである無電解ニッケルめっき液を用いて、金属板およびろう材の表面に、ニッケルめっき被膜を形成する工程と、を有し、ニッケルめっき被膜を形成する工程では、前記無電解ニッケルめっき液の鉛の濃度Ｙを０．０５≦Ｙ≦－０．００２Ｘ＋０．５の関係を満たすようにする、金属－セラミックス接合基板の製造方法。【選択図】図１
METHOD FOR MANUFACTURING METAL-CERAMIC BONDING SUBSTRATE, AND METAL-CERAMIC BONDING SUBSTRATE
To provide a technique capable of suppressing the occurrence of minute defects in a nickel plating film.SOLUTION: A method for manufacturing a metal-ceramic bonding substrate includes the steps of: bonding a metal plate, on at least one main surface of a ceramic substrate, through a brazing material containing silver and having a lead concentration of X ppm (X≤50); and using an electroless nickel plating solution with a lead concentration of Y mg/L to form a nickel plating film on the surfaces of the metal plate and the brazing material. In the step of forming a nickel plating film, a lead concentration Y in the electroless nickel plating solution is adjusted to satisfy a relationship of 0.05≤Y≤-0.002X+0.5.SELECTED DRAWING: Figure 1
【課題】ニッケルめっき被膜の微細な欠陥の発生を抑制することができる技術を提供する。【解決手段】セラミックス基板の少なくとも一方の主面上に、銀を含み、かつ、鉛の濃度がＸｐｐｍ（Ｘ≦５０）であるろう材を介して金属板を接合する工程と、鉛の濃度がＹｍｇ／Ｌである無電解ニッケルめっき液を用いて、金属板およびろう材の表面に、ニッケルめっき被膜を形成する工程と、を有し、ニッケルめっき被膜を形成する工程では、前記無電解ニッケルめっき液の鉛の濃度Ｙを０．０５≦Ｙ≦－０．００２Ｘ＋０．５の関係を満たすようにする、金属－セラミックス接合基板の製造方法。【選択図】図１
METHOD FOR MANUFACTURING METAL-CERAMIC BONDING SUBSTRATE, AND METAL-CERAMIC BONDING SUBSTRATE
金属－セラミックス接合基板の製造方法、および、金属－セラミックス接合基板
OZAKI AYUMI (author) / YUKI MASAYA (author)
2023-07-03
Patent
Electronic Resource
Japanese
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