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High thermal conductive aluminum nitride sintered body
The high thermal conductive aluminum nitride sintered body according to the present invention has: a thermal conductivity of 220 W/m · K or more; and a three point bending strength of 250 MPa or more; wherein a ratio (I Al 2 Y 4 O 9 /I AIN ) of X-ray diffraction intensity (I Al 2 Y 4 O 9 ) of Al 2 Y 4 O 9 (201 plane) with respect to X-ray diffraction intensity (I AIN ) of aluminum nitride (101 plane) is 0.002 to 0.03. According to the foregoing structure, there can be provided an aluminum nitride sintered body having a high thermal conductivity and excellent heat radiating property.
High thermal conductive aluminum nitride sintered body
The high thermal conductive aluminum nitride sintered body according to the present invention has: a thermal conductivity of 220 W/m · K or more; and a three point bending strength of 250 MPa or more; wherein a ratio (I Al 2 Y 4 O 9 /I AIN ) of X-ray diffraction intensity (I Al 2 Y 4 O 9 ) of Al 2 Y 4 O 9 (201 plane) with respect to X-ray diffraction intensity (I AIN ) of aluminum nitride (101 plane) is 0.002 to 0.03. According to the foregoing structure, there can be provided an aluminum nitride sintered body having a high thermal conductivity and excellent heat radiating property.
High thermal conductive aluminum nitride sintered body
Aluminiumnitridgesinterter Körper mit hoher thermischer Leitfähigkeit
Corps fritté au nitrure d'aluminium à forte conductivité thermique
KOMATSU MICHIYASU (author) / MIYASHITA KIMIYA (author)
2018-05-23
Patent
Electronic Resource
English
IPC:
C04B
Kalk
,
LIME
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