A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
WIRING SUBSTRATE, MULTI-PIECE WIRING SUBSTRATE, AND METHOD FOR MANUFACTURING SAME
Provided are a wiring substrate including a substrate main body and a metalized layer provided on the front surface of the substrate main body so as to extend along side surfaces thereof, in which a plating film and a brazing material layer covering the surface of the metalized layer are not damaged; a multi-piece wiring substrate array for simultaneously providing a plurality of the wiring substrates; and a method for producing the multi-piece wiring substrate array. The wiring substrate 1a includes a substrate main body 2 which is formed of a ceramic laminate S and has a rectangular shape in plan view, and which has a front surface 3 and a back surface 4 and has four side surfaces 5, each being located between the front surface 3 and the back surface 4, and having a groove surface 7 located on a side toward the front surface 3 and a fracture surface 6 located on a side toward the back surface 4; and a metalized layer 11 which is formed on the front surface 3 of the substrate main body 2 so as to extend along the four side surfaces 5, and which has a rectangular frame shape in plan view, wherein a horizontal surface 13 of the ceramic laminate S of the substrate main body 2 is exposed between the metalized layer 11 and the groove surface 7 of each side surface 5 of the substrate main body 2.
WIRING SUBSTRATE, MULTI-PIECE WIRING SUBSTRATE, AND METHOD FOR MANUFACTURING SAME
Provided are a wiring substrate including a substrate main body and a metalized layer provided on the front surface of the substrate main body so as to extend along side surfaces thereof, in which a plating film and a brazing material layer covering the surface of the metalized layer are not damaged; a multi-piece wiring substrate array for simultaneously providing a plurality of the wiring substrates; and a method for producing the multi-piece wiring substrate array. The wiring substrate 1a includes a substrate main body 2 which is formed of a ceramic laminate S and has a rectangular shape in plan view, and which has a front surface 3 and a back surface 4 and has four side surfaces 5, each being located between the front surface 3 and the back surface 4, and having a groove surface 7 located on a side toward the front surface 3 and a fracture surface 6 located on a side toward the back surface 4; and a metalized layer 11 which is formed on the front surface 3 of the substrate main body 2 so as to extend along the four side surfaces 5, and which has a rectangular frame shape in plan view, wherein a horizontal surface 13 of the ceramic laminate S of the substrate main body 2 is exposed between the metalized layer 11 and the groove surface 7 of each side surface 5 of the substrate main body 2.
WIRING SUBSTRATE, MULTI-PIECE WIRING SUBSTRATE, AND METHOD FOR MANUFACTURING SAME
VERDRAHTUNGSSUBSTRAT, MEHRTEILIGES VERDRAHTUNGSSUBSTRAT UND HERSTELLUNGSVERFAHREN DAFÜR
SUBSTRAT DE CÂBLAGE, SUBSTRAT DE CÂBLAGE EN PLUSIEURS MORCEAUX ET PROCÉDÉ DE FABRICATION DE CEUX-CI
HASEGAWA MASAMI (author) / HIRAYAMA SATOSHI (author) / KITO NAOKI (author)
2019-07-10
Patent
Electronic Resource
English
Wiring substrate, multi-piece wiring substrate, and method for manufacturing same
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