A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
CHIP-INLAID FLOORING MATERIAL USING PLA RESIN
Disclosed herein is a chip inlaid flooring material using a PLA resin. The chip inlaid flooring material includes a chip inlaid layer, a dimension stabilizing layer, and a base layer, from the top of the flooring material, wherein at least one of the chip inlaid layer and the base layer includes polylactic acid (PLA) resin as a binder.
CHIP-INLAID FLOORING MATERIAL USING PLA RESIN
Disclosed herein is a chip inlaid flooring material using a PLA resin. The chip inlaid flooring material includes a chip inlaid layer, a dimension stabilizing layer, and a base layer, from the top of the flooring material, wherein at least one of the chip inlaid layer and the base layer includes polylactic acid (PLA) resin as a binder.
CHIP-INLAID FLOORING MATERIAL USING PLA RESIN
BODENVERKLEIDUNGSMATERIAL MIT INTERNEN CHIPS MIT EINEM POLYMILCHSÄUREHARZ
MATÉRIAU DE PLANCHER D'INCRUSTATION DE PUCE UTILISANT UNE RÉSINE DE POLY(ACIDE LACTIQUE)
KWON HYUN-JONG (author) / KIM JI-YOUNG (author) / PARK KI-BONG (author) / KANG CHANG-WON (author) / KWON JUN-HYUK (author) / PARK SANG-SUN (author) / KIM JANG-KI (author) / LEE GYEONG-MIN (author) / HUANG CHENG-ZHE (author)
2017-10-18
Patent
Electronic Resource
English
IPC:
E04F
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
,
Ausbau von Bauwerken, z.B. Treppen, Fußböden
/
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
RESIN COMPOSITION FOR FLOORING MATERIAL WELDING ROD, AND FLOORING MATERIAL WELDING ROD
| European Patent Office | 2016