A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Chip through flooring material using PLA resin
Disclosed is a chip through flooring material using a PLA resin, which is environmentally friendly by using the PLA resin and can realize the texture of natural wood and the unique fragrance of trees. According to the present invention, the chip through flooring material using the PLA resin includes: a chip through layer; and a surface treatment layer which is formed on a surface of the chip through layer, wherein the chip through layer includes the PLA resin.
Chip through flooring material using PLA resin
Disclosed is a chip through flooring material using a PLA resin, which is environmentally friendly by using the PLA resin and can realize the texture of natural wood and the unique fragrance of trees. According to the present invention, the chip through flooring material using the PLA resin includes: a chip through layer; and a surface treatment layer which is formed on a surface of the chip through layer, wherein the chip through layer includes the PLA resin.
Chip through flooring material using PLA resin
HUANG CHENG-ZHE (author) / KIM JI-YOUNG (author) / PARK KI-BONG (author) / KANG CHANG-WON (author) / KWON JUN-HYUK (author) / KWON HYUN-JONG (author) / PARK SANG-SUN (author) / KIM JANG-KI (author) / LEE GYEONG-MIN (author)
2017-04-18
Patent
Electronic Resource
English
IPC:
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
E04F
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
,
Ausbau von Bauwerken, z.B. Treppen, Fußböden
RESIN COMPOSITION FOR FLOORING MATERIAL WELDING ROD, AND FLOORING MATERIAL WELDING ROD
| European Patent Office | 2016