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    VERFAHREN ZUR METALLISIERUNG VON DURCHKONTAKTIERUNGEN

    New search for: THIMM ALFRED
    New search for: HERRMANN KLAUS

    A method for producing plated-through holes in printed circuit boards and to printed circuit boards produced in this manner.

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    VERFAHREN ZUR METALLISIERUNG VON DURCHKONTAKTIERUNGEN

    New search for: THIMM ALFRED
    New search for: HERRMANN KLAUS

    A method for producing plated-through holes in printed circuit boards and to printed circuit boards produced in this manner.

    Access

    Download

    VERFAHREN ZUR METALLISIERUNG VON DURCHKONTAKTIERUNGEN

    New search for: THIMM ALFRED
    New search for: HERRMANN KLAUS

    A method for producing plated-through holes in printed circuit boards and to printed circuit boards produced in this manner.

    Access

    Download

    Access

    Download

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    VERFAHREN ZUR METALLISIERUNG VON DURCHKONTAKTIERUNGEN

    Additional title:

    METHOD FOR METALIZING PLATED-THROUGH HOLES
    PROCÉDÉ DE MÉTALLISATION DE TROUS DE CONNEXION

    Contributors:

    THIMM ALFRED (author) / HERRMANN KLAUS (author)

    Publication date:

    2017-06-28

    Type of media:

    Patent

    Type of material:

    Electronic Resource

    Language:

    German

    Classification:

    IPC:  H01B CABLES , Kabel / C04B Kalk , LIME / H05K PRINTED CIRCUITS , Gedruckte Schaltungen

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