A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
BONDED BODY, POWER MODULE SUBSTRATE, BONDED BODY MANUFACTURING METHOD, AND POWER MODULE SUBSTRATE MANUFACTURING METHOD
A bonded body of the present invention includes a ceramic member formed of ceramics and a Cu member formed of Cu or a Cu alloy. In a bonded interface between the ceramic member and the Cu member, a Cu-Sn layer which is positioned on the ceramic member side and in which Sn forms a solid solution in Cu, a first intermetallic compound layer which is positioned on the Cu member side and contains Cu and Ti, and a second intermetallic compound layer which is positioned between the first intermetallic compound layer and the Cu-Sn layer and contains P and Ti are formed.
BONDED BODY, POWER MODULE SUBSTRATE, BONDED BODY MANUFACTURING METHOD, AND POWER MODULE SUBSTRATE MANUFACTURING METHOD
A bonded body of the present invention includes a ceramic member formed of ceramics and a Cu member formed of Cu or a Cu alloy. In a bonded interface between the ceramic member and the Cu member, a Cu-Sn layer which is positioned on the ceramic member side and in which Sn forms a solid solution in Cu, a first intermetallic compound layer which is positioned on the Cu member side and contains Cu and Ti, and a second intermetallic compound layer which is positioned between the first intermetallic compound layer and the Cu-Sn layer and contains P and Ti are formed.
BONDED BODY, POWER MODULE SUBSTRATE, BONDED BODY MANUFACTURING METHOD, AND POWER MODULE SUBSTRATE MANUFACTURING METHOD
VERBUNDENER KÖRPER, LEISTUNGSMODULSUBSTRAT, HERSTELLUNGSVERFAHREN FÜR VERBUNDENEN KÖRPER UND LEISTUNGSMODULSUBSTRATHERSTELLUNGSVERFAHREN
CORPS LIÉ AINSI QUE PROCÉDÉ DE FABRICATION DE CELUI-CI, ET SUBSTRAT POUR MODULE DE PUISSANCE AINSI QUE PROCÉDÉ DE FABRICATION DE CELUI-CI
TERASAKI NOBUYUKI (author) / NAGATOMO YOSHIYUKI (author)
2021-06-02
Patent
Electronic Resource
English
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