A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
BONDED BODY, POWER MODULE SUBSTRATE, POWER MODULE, BONDED BODY MANUFACTURING METHOD, AND POWER MODULE SUBSTRATE MANUFACTURING METHOD
A bonded body of the present invention includes a ceramic member formed of ceramics and a Cu member formed of Cu or a Cu alloy. In a bonding layer formed between the ceramic member and the Cu member, an area ratio of a Cu 3 P phase in a region extending by up to 50 µm toward the Cu member side from a bonding surface of the ceramic member is equal to or lower than 15%.
BONDED BODY, POWER MODULE SUBSTRATE, POWER MODULE, BONDED BODY MANUFACTURING METHOD, AND POWER MODULE SUBSTRATE MANUFACTURING METHOD
A bonded body of the present invention includes a ceramic member formed of ceramics and a Cu member formed of Cu or a Cu alloy. In a bonding layer formed between the ceramic member and the Cu member, an area ratio of a Cu 3 P phase in a region extending by up to 50 µm toward the Cu member side from a bonding surface of the ceramic member is equal to or lower than 15%.
BONDED BODY, POWER MODULE SUBSTRATE, POWER MODULE, BONDED BODY MANUFACTURING METHOD, AND POWER MODULE SUBSTRATE MANUFACTURING METHOD
GEBONDETER KÖRPER, LEISTUNGSMODULSUBSTRAT, LEISTUNGSMODUL, VERFAHREN ZUR HERSTELLUNG EINES GEBONDETEN KÖRPERS UND VERFAHREN ZUR HERSTELLUNG EINES LEISTUNGSMODULSUBSTRATS
CORPS LIÉ AINSI QUE PROCÉDÉ DE FABRICATION DE CELUI-CI, SUBSTRAT POUR MODULE DE PUISSANCE AINSI QUE PROCÉDÉ DE FABRICATION DE CELUI-CI, ET MODULE DE PUISSANCE
TERASAKI NOBUYUKI (author) / NAGATOMO YOSHIYUKI (author)
2022-02-23
Patent
Electronic Resource
English
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