A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
CERAMIC CIRCUIT SUBSTRATE AND METHOD FOR PRODUCING CERAMIC CIRCUIT SUBSTRATE
A ceramic circuit substrate according to the present invention includes a ceramic substrate, a copper circuit made of a copper-based material bonded, via a bonding layer, to a surface of the ceramic, and a copper heat sink made of the copper-based material bonded, via a bonding layer, to the other surface of the ceramic. The bonding layers each include a brazing material component including two or more kinds of metals, such as Ag, and an active metal having a predetermined concentration. The bonding layers each include a brazing material layer including the brazing material component, and an active metal compound layer containing the active metal. A ratio of a bonding area of the active metal compound layer in a bonding area of each of the bonding layers is 88% or more.
CERAMIC CIRCUIT SUBSTRATE AND METHOD FOR PRODUCING CERAMIC CIRCUIT SUBSTRATE
A ceramic circuit substrate according to the present invention includes a ceramic substrate, a copper circuit made of a copper-based material bonded, via a bonding layer, to a surface of the ceramic, and a copper heat sink made of the copper-based material bonded, via a bonding layer, to the other surface of the ceramic. The bonding layers each include a brazing material component including two or more kinds of metals, such as Ag, and an active metal having a predetermined concentration. The bonding layers each include a brazing material layer including the brazing material component, and an active metal compound layer containing the active metal. A ratio of a bonding area of the active metal compound layer in a bonding area of each of the bonding layers is 88% or more.
CERAMIC CIRCUIT SUBSTRATE AND METHOD FOR PRODUCING CERAMIC CIRCUIT SUBSTRATE
KERAMISCHES SCHALTUNGSSUBSTRAT UND VERFAHREN ZUR HERSTELLUNG EINES KERAMISCHEN SCHALTUNGSSUBSTRATS
SUBSTRAT DE CIRCUIT EN CÉRAMIQUE ET PROCÉDÉ DE PRODUCTION D'UN SUBSTRAT DE CIRCUIT EN CÉRAMIQUE
KISHIMOTO TAKAOMI (author)
2024-08-21
Patent
Electronic Resource
English
IPC:
H05K
PRINTED CIRCUITS
,
Gedruckte Schaltungen
/
B23K
Löten
,
SOLDERING OR UNSOLDERING
/
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
C04B
Kalk
,
LIME
/
C22C
Legierungen
,
ALLOYS
/
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
Ceramic circuit substrate and method for producing ceramic circuit substrate
| European Patent Office | 2019
CERAMIC CIRCUIT SUBSTRATE AND METHOD FOR PRODUCING CERAMIC CIRCUIT SUBSTRATE
| European Patent Office | 2019
| European Patent Office | 2024