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CERAMIC CIRCUIT SUBSTRATE, METHOD FOR MANUFACTURING CERAMIC CIRCUIT SUBSTRATE, AND MODULE USING CERAMIC CIRCUIT SUBSTRATE
[Problem] To provide a ceramic circuit substrate and power module with excellent heat cycle resistance characteristics.[Solution] Provided is a ceramic circuit substrate formed by bonding a ceramic substrate and a copper plate via a brazing material comprising Ag, Cu, and an active metal, wherein the bond void fraction is no greater than 1.0% and the diffusion distance of the Ag, which is a brazing material component, is 5-20 µm. Provided is a method for manufacturing a ceramic circuit substrate characterized in that the heating time in a temperature range 400-700°C in a process for raising the temperature to a bonding temperature is 5-30 minutes and bonding is performed by maintaining the bonding temperature at 720-800°C for 5-30 minutes.
CERAMIC CIRCUIT SUBSTRATE, METHOD FOR MANUFACTURING CERAMIC CIRCUIT SUBSTRATE, AND MODULE USING CERAMIC CIRCUIT SUBSTRATE
[Problem] To provide a ceramic circuit substrate and power module with excellent heat cycle resistance characteristics.[Solution] Provided is a ceramic circuit substrate formed by bonding a ceramic substrate and a copper plate via a brazing material comprising Ag, Cu, and an active metal, wherein the bond void fraction is no greater than 1.0% and the diffusion distance of the Ag, which is a brazing material component, is 5-20 µm. Provided is a method for manufacturing a ceramic circuit substrate characterized in that the heating time in a temperature range 400-700°C in a process for raising the temperature to a bonding temperature is 5-30 minutes and bonding is performed by maintaining the bonding temperature at 720-800°C for 5-30 minutes.
CERAMIC CIRCUIT SUBSTRATE, METHOD FOR MANUFACTURING CERAMIC CIRCUIT SUBSTRATE, AND MODULE USING CERAMIC CIRCUIT SUBSTRATE
KERAMISCHE LEITERPLATTE, VERFAHREN ZUR HERSTELLUNG EINER KERAMISCHEN LEITERPLATTE UND MODUL MIT KERAMISCHER LEITERPLATTE
SUBSTRAT CÉRAMIQUE POUR CIRCUIT IMPRIMÉ, PROCÉDÉ DE FABRICATION DE SUBSTRAT CÉRAMIQUE POUR CIRCUIT IMPRIMÉ, ET MODULE UTILISANT UN SUBSTRAT CÉRAMIQUE POUR CIRCUIT IMPRIMÉ
HARADA YUSAKU (author) / YUASA AKIMASA (author) / NAKAMURA TAKAHIRO (author) / MORITA SHUHEI (author) / NISHIMURA KOUJI (author)
2024-06-26
Patent
Electronic Resource
English
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