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CERAMIC CIRCUIT BOARD AND METHOD FOR PRODUCING SAME
[Problem] To provide a ceramic circuit substrate having excellent thermal cycling resistance properties. [Solution] A ceramic circuit substrate having a metal plate bonded, by a bonding braze material, to at least one main surface of a ceramic substrate, wherein the bonding braze material contains, as metal components, 0.5 to 4.0 parts by mass of at least one active metal selected from among titanium, zirconium, hafnium, and niobium, with respect to 100 parts by mass, in total, of 93.0 to 99.4 parts by mass of Ag, 0.1 to 5.0 parts by mass of Cu, and 0.5 to 2.0 parts by mass of Sn; and Cu-rich phases in a bonding braze material layer structure between the ceramic substrate and the metal plate have an average size of 3.5 µm or less and a number density of 0.015/µm2or higher. A method for producing a ceramic circuit substrate wherein the method involves bonding at a bonding temperature of 855 to 900 °C and for a retention time of 10 to 60 minutes.
CERAMIC CIRCUIT BOARD AND METHOD FOR PRODUCING SAME
[Problem] To provide a ceramic circuit substrate having excellent thermal cycling resistance properties. [Solution] A ceramic circuit substrate having a metal plate bonded, by a bonding braze material, to at least one main surface of a ceramic substrate, wherein the bonding braze material contains, as metal components, 0.5 to 4.0 parts by mass of at least one active metal selected from among titanium, zirconium, hafnium, and niobium, with respect to 100 parts by mass, in total, of 93.0 to 99.4 parts by mass of Ag, 0.1 to 5.0 parts by mass of Cu, and 0.5 to 2.0 parts by mass of Sn; and Cu-rich phases in a bonding braze material layer structure between the ceramic substrate and the metal plate have an average size of 3.5 µm or less and a number density of 0.015/µm2or higher. A method for producing a ceramic circuit substrate wherein the method involves bonding at a bonding temperature of 855 to 900 °C and for a retention time of 10 to 60 minutes.
CERAMIC CIRCUIT BOARD AND METHOD FOR PRODUCING SAME
KERAMIKLEITERPLATTE UND VERFAHREN ZUR HERSTELLUNG DAVON
CARTE DE CIRCUIT IMPRIMÉ EN CÉRAMIQUE ET PROCÉDÉ POUR SA PRODUCTION
HARADA YUSAKU (author) / YUASA AKIMASA (author) / NAKAMURA TAKAHIRO (author) / MORITA SHUHEI (author) / NISHIMURA KOUJI (author)
2022-02-09
Patent
Electronic Resource
English