A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
HEAT DISSIPATING ELEMENT AND PREPARATION METHOD THEREFOR, AND IGBT MODULE
The present disclosure relates to a heat dissipation element, a method for manufacturing the heat dissipation element, and an IGBT module. The heat dissipation element includes a heat conductor and a heat dissipation body; the heat conductor is a ceramic-coated aluminum copper heat conductor; the heat dissipation body is an aluminum silicon carbon heat dissipation body; the ceramic-coated aluminum copper heat conductor includes a ceramic insulating plate, a copper layer, and a first aluminum layer and a second aluminum layer that are located on two opposite surfaces of the ceramic insulating plate, where the first aluminum layer and the second aluminum layer are isolated by the ceramic insulating plate, and the copper layer is bonded to the ceramic insulating plate by using the second aluminum layer that is integrally formed through aluminizing; the ceramic insulating plate is bonded to the aluminum silicon carbon heat dissipation body by using the first aluminum layer that is integrally formed through aluminizing; and the IGBT module includes the foregoing heat dissipation element.
HEAT DISSIPATING ELEMENT AND PREPARATION METHOD THEREFOR, AND IGBT MODULE
The present disclosure relates to a heat dissipation element, a method for manufacturing the heat dissipation element, and an IGBT module. The heat dissipation element includes a heat conductor and a heat dissipation body; the heat conductor is a ceramic-coated aluminum copper heat conductor; the heat dissipation body is an aluminum silicon carbon heat dissipation body; the ceramic-coated aluminum copper heat conductor includes a ceramic insulating plate, a copper layer, and a first aluminum layer and a second aluminum layer that are located on two opposite surfaces of the ceramic insulating plate, where the first aluminum layer and the second aluminum layer are isolated by the ceramic insulating plate, and the copper layer is bonded to the ceramic insulating plate by using the second aluminum layer that is integrally formed through aluminizing; the ceramic insulating plate is bonded to the aluminum silicon carbon heat dissipation body by using the first aluminum layer that is integrally formed through aluminizing; and the IGBT module includes the foregoing heat dissipation element.
HEAT DISSIPATING ELEMENT AND PREPARATION METHOD THEREFOR, AND IGBT MODULE
WÄRMEABLEITELEMENT UND VERFAHREN ZU DESSEN HERSTELLUNG SOWIE IGBT-MODUL
ÉLÉMENT DE DISSIPATION DE CHALEUR ET SON PROCÉDÉ DE PRÉPARATION, ET MODULE IGBT
XU QIANG (author) / LIN XINPING (author) / LIU CHENGCHEN (author)
2020-08-19
Patent
Electronic Resource
English
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