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HEAT DISSIPATION ELEMENT AND PREPARATION METHOD THEREFOR, AND IGBT MODULE
The present disclosure relates to a heat dissipation element, a method for manufacturing the heat dissipation element, and an IGBT module. The heat dissipation element includes a heat conductor and a heat dissipation body, where the heat conductor is an aluminum-clad ceramic heat conductor; the heat dissipation body is an aluminum silicon carbon heat dissipation body; the aluminum silicon carbon heat dissipation body is provided with at least one groove; and the aluminum-clad ceramic heat conductor is embedded into the groove through aluminizing in an integral forming manner. The present disclosure further provides a method for manufacturing the foregoing heat dissipation element and an IGBT module including the foregoing heat dissipation element.
HEAT DISSIPATION ELEMENT AND PREPARATION METHOD THEREFOR, AND IGBT MODULE
The present disclosure relates to a heat dissipation element, a method for manufacturing the heat dissipation element, and an IGBT module. The heat dissipation element includes a heat conductor and a heat dissipation body, where the heat conductor is an aluminum-clad ceramic heat conductor; the heat dissipation body is an aluminum silicon carbon heat dissipation body; the aluminum silicon carbon heat dissipation body is provided with at least one groove; and the aluminum-clad ceramic heat conductor is embedded into the groove through aluminizing in an integral forming manner. The present disclosure further provides a method for manufacturing the foregoing heat dissipation element and an IGBT module including the foregoing heat dissipation element.
HEAT DISSIPATION ELEMENT AND PREPARATION METHOD THEREFOR, AND IGBT MODULE
WÄRMEABLEITUNGSELEMENT UND VERFAHREN ZU DESSEN HERSTELLUNG SOWIE IGBT-MODUL
ÉLÉMENT DE DISSIPATION DE CHALEUR ET SON PROCÉDÉ DE PRÉPARATION, ET MODULE IGBT
GONG QING (author) / LIN XINPING (author) / XU QIANG (author) / LIU CHENGCHEN (author)
2025-01-15
Patent
Electronic Resource
English
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