A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
NITRIDE CERAMIC RESIN COMPOSITE BODY
A nitride-based ceramics resin composite body having thermal conductivity, electrical insulation, and adhesion to adherends equal to conventional products, and having improved heat resistance reliability during the reflow process, and a thermal conductive insulating adhesive sheet using the same are provided. A nitride-based ceramics resin composite body in which a thermosetting resin composition is impregnated in a porous nitride-based ceramics sintered body is provided. The thermosetting resin composition includes a specific epoxy resin and a bismaleimide triazine resin, and a water absorption of the thermosetting resin composition in a completely cured state measured in accordance with method A in JIS K7209 (2000) is 1% by mass or less.
NITRIDE CERAMIC RESIN COMPOSITE BODY
A nitride-based ceramics resin composite body having thermal conductivity, electrical insulation, and adhesion to adherends equal to conventional products, and having improved heat resistance reliability during the reflow process, and a thermal conductive insulating adhesive sheet using the same are provided. A nitride-based ceramics resin composite body in which a thermosetting resin composition is impregnated in a porous nitride-based ceramics sintered body is provided. The thermosetting resin composition includes a specific epoxy resin and a bismaleimide triazine resin, and a water absorption of the thermosetting resin composition in a completely cured state measured in accordance with method A in JIS K7209 (2000) is 1% by mass or less.
NITRIDE CERAMIC RESIN COMPOSITE BODY
VERBUNDKÖRPER AUS NITRIDKERAMIKHARZ
CORPS COMPOSITE DE RÉSINE CÉRAMIQUE DE NITRURE
MINAKATA YOSHITAKA (author) / SASAKI ERI (author) / YAMAGATA TOSHITAKA (author) / INOUE SAORI (author) / YOSHIMATU RYO (author) / KOGA RYUJI (author)
2021-10-13
Patent
Electronic Resource
English
IPC:
C08L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
,
Massen auf Basis makromolekularer Verbindungen
/
C04B
Kalk
,
LIME
/
C08K
Verwendung von anorganischen oder nichtmakromolekularen organischen Stoffen als Zusatzstoffe
,
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
/
C09J
ADHESIVES
,
Klebstoffe
/
C09K
Materialien für Anwendungen, soweit nicht anderweitig vorgesehen
,
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR
/
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
/
H05K
PRINTED CIRCUITS
,
Gedruckte Schaltungen