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METHOD FOR MANUFACTURING SUBSTRATE FOR POWER MODULE, AND CERAMIC-COPPER JOINT BODY
To provide a method of manufacturing power module substrate board at high productivity and a ceramic-copper bonded body in which warps are reduced.In a bonded body-forming step, a circuit layer-forming copper layer consisting of a plurality of first copper layers is formed by arranging and bonding a plurality of first copper boards on a first surface of a ceramic board, and a metal layer-forming copper layer consisting of a second copper layer with a smaller arrangement number than that of the first copper layers is formed by bonding a second copper board having a larger planar area than that of the first copper board and a smaller thickness than that of the first copper board so as to cover at least two of adjacent substrate board-forming areas on a second surface of the ceramic board among the substrate board-forming areas partitioned by the dividing groove.
METHOD FOR MANUFACTURING SUBSTRATE FOR POWER MODULE, AND CERAMIC-COPPER JOINT BODY
To provide a method of manufacturing power module substrate board at high productivity and a ceramic-copper bonded body in which warps are reduced.In a bonded body-forming step, a circuit layer-forming copper layer consisting of a plurality of first copper layers is formed by arranging and bonding a plurality of first copper boards on a first surface of a ceramic board, and a metal layer-forming copper layer consisting of a second copper layer with a smaller arrangement number than that of the first copper layers is formed by bonding a second copper board having a larger planar area than that of the first copper board and a smaller thickness than that of the first copper board so as to cover at least two of adjacent substrate board-forming areas on a second surface of the ceramic board among the substrate board-forming areas partitioned by the dividing groove.
METHOD FOR MANUFACTURING SUBSTRATE FOR POWER MODULE, AND CERAMIC-COPPER JOINT BODY
VERFAHREN ZUR HERSTELLUNG EINES SUBSTRATS FÜR LEISTUNGSMODUL UND KERAMIK-KUPFER-VERBINDUNGSKÖRPER
PROCÉDÉ DE FABRICATION DE SUBSTRAT POUR MODULE DE PUISSANCE, ET CORPS DE JOINT CÉRAMIQUE-CUIVRE
KITAHARA TAKESHI (author) / OOHIRAKI TOMOYA (author) / NAGATOMO YOSHIYUKI (author)
2021-10-27
Patent
Electronic Resource
English
Method of manufacturing power module substrate board and ceramic-copper bonded body
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