A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
COPPER-CERAMIC BONDED BODY AND POWER MODULE SUBSTRATE
There is a provided a copper-ceramic bonded body in which a copper member formed of copper or a copper alloy and a ceramic member formed of nitride ceramic are bonded to each other, in which an active element oxide layer containing an active element and oxygen is formed at bonding interfaces between the copper member and the ceramic member, and a thickness t of the active element oxide layer is in a range of 5 nm to 220 nm.
COPPER-CERAMIC BONDED BODY AND POWER MODULE SUBSTRATE
There is a provided a copper-ceramic bonded body in which a copper member formed of copper or a copper alloy and a ceramic member formed of nitride ceramic are bonded to each other, in which an active element oxide layer containing an active element and oxygen is formed at bonding interfaces between the copper member and the ceramic member, and a thickness t of the active element oxide layer is in a range of 5 nm to 220 nm.
COPPER-CERAMIC BONDED BODY AND POWER MODULE SUBSTRATE
TERASAKI NOBUYUKI (author) / NAGATOMO YOSHIYUKI (author)
2016-12-08
Patent
Electronic Resource
English
Method of manufacturing power module substrate board and ceramic-copper bonded body
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