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DIAMOND STRUCTURES FOR TOOLING
A tool such as a wafer handler or wafer chuck can include a surface having at least one protrusion. A diamond coating is formed from diamond grains sized so that 90% of the grains are between 200 and 300 nanometers, with the diamond coating being deposited on the surface at a temperature below 500 degrees Celsius over the at least one protrusion. Dopants can be used to provide electrical conductivity needed for electrostatic wafer chuck.
DIAMOND STRUCTURES FOR TOOLING
A tool such as a wafer handler or wafer chuck can include a surface having at least one protrusion. A diamond coating is formed from diamond grains sized so that 90% of the grains are between 200 and 300 nanometers, with the diamond coating being deposited on the surface at a temperature below 500 degrees Celsius over the at least one protrusion. Dopants can be used to provide electrical conductivity needed for electrostatic wafer chuck.
DIAMOND STRUCTURES FOR TOOLING
DIAMANTSTRUKTUREN FÜR WERKZEUGE
STRUCTURES DE DIAMANT POUR OUTILLAGE
KHAN ADAM (author) / KOVI KIRAN KUMAR (author)
2024-05-29
Patent
Electronic Resource
English
IPC:
C23C
Beschichten metallischer Werkstoffe
,
COATING METALLIC MATERIAL
/
B24B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
,
Maschinen, Einrichtungen oder Verfahren zum Schleifen oder Polieren
/
B24D
TOOLS FOR GRINDING, BUFFING OR SHARPENING
,
Werkzeuge zum Schleifen, Polieren oder Schärfen
/
C04B
Kalk
,
LIME
/
C30B
SINGLE-CRYSTAL GROWTH
,
Züchten von Einkristallen
/
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
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|IET Digital Library Archive | 1995