A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
PROBLEM TO BE SOLVED: To provide a bonding agent capable of achieving a simple bond of a ceramic member in the ordinary temperature range, the bond having thermal resistance, chemical stability, and durability (for example, strength and resistance to environment).SOLUTION: A bonding agent 20 is used to bond at least one ceramic member to one object member of bonding. The bonding agent includes a liquid main agent containing a water soluble glass precursor that is curable in the temperature range of 5-200°C and is to be cured to obtain a cured glass component having a thermal expansion coefficient of 3-10×10Kat 25-500°C, an adjustment agent of thermal expansion coefficient, and an auxiliary agent containing a curing catalyst to promote curing of the water soluble glass precursor. The thermal expansion coefficient of a bond part obtained by curing the bonding agent is adjusted to be 5-10×10Kat 25-500°C.
【課題】常温域でセラミックス部材の簡便な接合が可能であり、かつ、耐熱性、化学的安定性、耐久性（例えば、強度および耐環境性等）を備えた接合を実現し得る接合材を提供する。【解決手段】接合材２０は、少なくとも一のセラミックス部材と一の被接合部材とを接合するために使用される接合材であり、５〜２００℃の温度範囲でガラス硬化可能であって、硬化後に得られるガラス成分の２５〜５００℃の熱膨張係数が３〜１０?１０−６Ｋ−１である水溶性ガラス前駆体を含む液状の主材と、熱膨張係数調整材と、上記水溶性ガラス前駆体の硬化を促進する硬化触媒を含む助材と、を備え、当該接合材を硬化して得られる接合部の２５〜５００℃の熱膨張係数が５〜１０?１０−６Ｋ−１となるように調製されている。【選択図】図１
PROBLEM TO BE SOLVED: To provide a bonding agent capable of achieving a simple bond of a ceramic member in the ordinary temperature range, the bond having thermal resistance, chemical stability, and durability (for example, strength and resistance to environment).SOLUTION: A bonding agent 20 is used to bond at least one ceramic member to one object member of bonding. The bonding agent includes a liquid main agent containing a water soluble glass precursor that is curable in the temperature range of 5-200°C and is to be cured to obtain a cured glass component having a thermal expansion coefficient of 3-10×10Kat 25-500°C, an adjustment agent of thermal expansion coefficient, and an auxiliary agent containing a curing catalyst to promote curing of the water soluble glass precursor. The thermal expansion coefficient of a bond part obtained by curing the bonding agent is adjusted to be 5-10×10Kat 25-500°C.
【課題】常温域でセラミックス部材の簡便な接合が可能であり、かつ、耐熱性、化学的安定性、耐久性（例えば、強度および耐環境性等）を備えた接合を実現し得る接合材を提供する。【解決手段】接合材２０は、少なくとも一のセラミックス部材と一の被接合部材とを接合するために使用される接合材であり、５〜２００℃の温度範囲でガラス硬化可能であって、硬化後に得られるガラス成分の２５〜５００℃の熱膨張係数が３〜１０?１０−６Ｋ−１である水溶性ガラス前駆体を含む液状の主材と、熱膨張係数調整材と、上記水溶性ガラス前駆体の硬化を促進する硬化触媒を含む助材と、を備え、当該接合材を硬化して得られる接合部の２５〜５００℃の熱膨張係数が５〜１０?１０−６Ｋ−１となるように調製されている。【選択図】図１
BONDING AGENT
接合材
TAKAHASHI YOSUKE (author)
2015-06-08
Patent
Electronic Resource
Japanese
IPC:
C04B
Kalk
,
LIME
Bonding agent, stemming including bonding agent and preparation method of stemming
| European Patent Office | 2015
Bonding agent for bonding aluminum nitride ceramics and bonding method
| European Patent Office | 2025