A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
HEAT-SINK-ATTACHED SUBSTRATE FOR POWER MODULES, AND POWER MODULE
PROBLEM TO BE SOLVED: To provide a heat-sink-attached substrate for power modules, which is small in warp not only in bonding, but also in a mounting step or under a use environment; and a power module.SOLUTION: A heat-sink-attached substrate for power modules comprises: a ceramic base 11; a circuit layer 12 bonded to the ceramic base on one surface thereof; a metal layer 13 on the other surface of the ceramic base 11; and a heat sink 20 bonded through the metal layer 13 to the ceramic base. The metal layer 13 is composed of an aluminum plate of which the purity is 99.99 mass% or more. The heat sink 20 is composed of an aluminum plate of which the purity is 99.90 mass% or less. The circuit layer 12 has a laminate structure, and includes a first layer 15 and a second layer 16. The first layer 15 is composed of an aluminum plate of which the purity is 99.99 mass% or more, and bonded to the ceramic base 11. The second layer 16 is composed of an aluminum plate of which the purity is less than 99.90 mass%, and bonded to a surface of the first layer 15.
【課題】接合時のみならず、実装工程時や使用環境においても反りが少ないヒートシンク付きパワーモジュール用基板及びパワーモジュールを提供する。【解決手段】セラミックス基板１１の一方の面に回路層１２が接合されるとともに、セラミックス基板１１の他方の面に金属層１３を介してヒートシンク２０が接合されてなり、金属層１３が純度９９．９９質量％以上のアルミニウム板であり、ヒートシンク２０が純度９９．９０質量％以下のアルミニウム板であり、回路層１２が、セラミックス基板１１に接合された純度９９．９９質量％以上のアルミニウム板からなる第１層１５と、第１層１５の表面に接合された純度９９．９０質量％未満のアルミニウム板からなる第２層１６との積層構造とされている。【選択図】 図１
HEAT-SINK-ATTACHED SUBSTRATE FOR POWER MODULES, AND POWER MODULE
PROBLEM TO BE SOLVED: To provide a heat-sink-attached substrate for power modules, which is small in warp not only in bonding, but also in a mounting step or under a use environment; and a power module.SOLUTION: A heat-sink-attached substrate for power modules comprises: a ceramic base 11; a circuit layer 12 bonded to the ceramic base on one surface thereof; a metal layer 13 on the other surface of the ceramic base 11; and a heat sink 20 bonded through the metal layer 13 to the ceramic base. The metal layer 13 is composed of an aluminum plate of which the purity is 99.99 mass% or more. The heat sink 20 is composed of an aluminum plate of which the purity is 99.90 mass% or less. The circuit layer 12 has a laminate structure, and includes a first layer 15 and a second layer 16. The first layer 15 is composed of an aluminum plate of which the purity is 99.99 mass% or more, and bonded to the ceramic base 11. The second layer 16 is composed of an aluminum plate of which the purity is less than 99.90 mass%, and bonded to a surface of the first layer 15.
【課題】接合時のみならず、実装工程時や使用環境においても反りが少ないヒートシンク付きパワーモジュール用基板及びパワーモジュールを提供する。【解決手段】セラミックス基板１１の一方の面に回路層１２が接合されるとともに、セラミックス基板１１の他方の面に金属層１３を介してヒートシンク２０が接合されてなり、金属層１３が純度９９．９９質量％以上のアルミニウム板であり、ヒートシンク２０が純度９９．９０質量％以下のアルミニウム板であり、回路層１２が、セラミックス基板１１に接合された純度９９．９９質量％以上のアルミニウム板からなる第１層１５と、第１層１５の表面に接合された純度９９．９０質量％未満のアルミニウム板からなる第２層１６との積層構造とされている。【選択図】 図１
HEAT-SINK-ATTACHED SUBSTRATE FOR POWER MODULES, AND POWER MODULE
ヒートシンク付きパワーモジュール用基板及びパワーモジュール
OI SOTARO (author) / OHIRAKI TOMOYA (author)
2015-12-03
Patent
Electronic Resource
Japanese
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