A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
METAL-CERAMIC BONDED SUBSTRATE
PROBLEM TO BE SOLVED: To provide a metal-ceramic bonded substrate excellent in bond strength between a ceramic substrate made of aluminum nitride excellent in heat dissipation properties and a copper plate or copper alloy plate as a metal plate, and also excellent in heat cycle resistant characteristics.SOLUTION: In a metal-ceramic bonded substrate, a copper plate or copper alloy plate as a metal plate (a metal circuit plate 14 and a heat dissipation metal plate 16) is bonded to each surface of a ceramic substrate 10 made of aluminum nitride (preferably via a brazing filler material 12). In the metal-ceramic bonded substrate, the thickness of the ceramic substrate is 0.25-0.45 mm, and the thickness of the metal plate is 0.20-0.28 mm.SELECTED DRAWING: Figure 1
【課題】放熱性に優れた窒化アルミニウムからなるセラミックス基板と金属板としての銅板または銅合金板との接合強度に優れるとともに、耐ヒートサイクル特性に優れた金属−セラミックス接合基板を提供する。【解決手段】窒化アルミニウムからなるセラミックス基板１０の各々の面に（好ましくはろう材１２を介して）金属板（金属回路板１４と放熱用金属板１６）として銅板または銅合金板が接合された金属−セラミックス接合基板において、セラミックス基板の厚さが０．２５〜０．４５ｍｍ、金属板の厚さが０．２０〜０．２８ｍｍである。【選択図】図１
METAL-CERAMIC BONDED SUBSTRATE
PROBLEM TO BE SOLVED: To provide a metal-ceramic bonded substrate excellent in bond strength between a ceramic substrate made of aluminum nitride excellent in heat dissipation properties and a copper plate or copper alloy plate as a metal plate, and also excellent in heat cycle resistant characteristics.SOLUTION: In a metal-ceramic bonded substrate, a copper plate or copper alloy plate as a metal plate (a metal circuit plate 14 and a heat dissipation metal plate 16) is bonded to each surface of a ceramic substrate 10 made of aluminum nitride (preferably via a brazing filler material 12). In the metal-ceramic bonded substrate, the thickness of the ceramic substrate is 0.25-0.45 mm, and the thickness of the metal plate is 0.20-0.28 mm.SELECTED DRAWING: Figure 1
【課題】放熱性に優れた窒化アルミニウムからなるセラミックス基板と金属板としての銅板または銅合金板との接合強度に優れるとともに、耐ヒートサイクル特性に優れた金属−セラミックス接合基板を提供する。【解決手段】窒化アルミニウムからなるセラミックス基板１０の各々の面に（好ましくはろう材１２を介して）金属板（金属回路板１４と放熱用金属板１６）として銅板または銅合金板が接合された金属−セラミックス接合基板において、セラミックス基板の厚さが０．２５〜０．４５ｍｍ、金属板の厚さが０．２０〜０．２８ｍｍである。【選択図】図１
METAL-CERAMIC BONDED SUBSTRATE
金属−セラミックス接合基板
KITAMURA MASAHIRO (author) / OZAKI AYUMI (author) / IDENO TAKASHI (author)
2016-04-11
Patent
Electronic Resource
Japanese
METAL-CERAMIC BONDED SUBSTRATE AND MANUFACTURING METHOD THEREFOR
| European Patent Office | 2022
METAL-CERAMIC BONDED SUBSTRATE AND MANUFACTURING METHOD THEREOF
| European Patent Office | 2022