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A platform for research: civil engineering, architecture and urbanism
HOLLOW STRUCTURE MANUFACTURING METHOD AND HOLLOW STRUCTURE
PROBLEM TO BE SOLVED: To provide a hollow structure manufacturing method that can suppress a bonding agent, applied to a bonding surface at the time of bonding a ceramic molding, from flowing out into a hollow structural part.SOLUTION: A hollow structure manufacturing method includes the steps of: preparing ceramic moldings 11, 12 where grooves 11b, 12b serving as a hollow structural part are formed in bonding surfaces 11a, 12a and the bonding surfaces 11a, 12a are chamfered with a chamfering length of 0.10-5.00 mm at a boundary portion between the grooves 11b, 12b and the bonding surfaces 11a, 12a; bonding the ceramic moldings 11, 12 to the bonding surfaces 11a, 12a through a bonding agent; and firing the bonded ceramic moldings.SELECTED DRAWING: Figure 1
【課題】セラミックス成形体の接合時に接合面に塗布などした接合剤が中空構造部内に流れ出し難くすることを図りうる中空構造体の製造方法を提供する。【解決手段】中空構造部となる溝１１ｂ，１２ｂが接合面１１ａ，１２ａに形成され、溝１１ｂ、１２ｂと接合面１１ａ，１２ａとの境界部分に、当該接合面１１ａ，１２ａにおける面取り長さが０．１０ｍｍ〜５．００ｍｍの面取り加工されたセラミックス成形体１１，１２を用意する工程と、セラミックス成形体１１，１２を接合面１１ａ，１２ａに接合剤を介した状態で接合する工程と、接合したセラミックス成形体を焼成する工程とを備える。【選択図】図１
HOLLOW STRUCTURE MANUFACTURING METHOD AND HOLLOW STRUCTURE
PROBLEM TO BE SOLVED: To provide a hollow structure manufacturing method that can suppress a bonding agent, applied to a bonding surface at the time of bonding a ceramic molding, from flowing out into a hollow structural part.SOLUTION: A hollow structure manufacturing method includes the steps of: preparing ceramic moldings 11, 12 where grooves 11b, 12b serving as a hollow structural part are formed in bonding surfaces 11a, 12a and the bonding surfaces 11a, 12a are chamfered with a chamfering length of 0.10-5.00 mm at a boundary portion between the grooves 11b, 12b and the bonding surfaces 11a, 12a; bonding the ceramic moldings 11, 12 to the bonding surfaces 11a, 12a through a bonding agent; and firing the bonded ceramic moldings.SELECTED DRAWING: Figure 1
【課題】セラミックス成形体の接合時に接合面に塗布などした接合剤が中空構造部内に流れ出し難くすることを図りうる中空構造体の製造方法を提供する。【解決手段】中空構造部となる溝１１ｂ，１２ｂが接合面１１ａ，１２ａに形成され、溝１１ｂ、１２ｂと接合面１１ａ，１２ａとの境界部分に、当該接合面１１ａ，１２ａにおける面取り長さが０．１０ｍｍ〜５．００ｍｍの面取り加工されたセラミックス成形体１１，１２を用意する工程と、セラミックス成形体１１，１２を接合面１１ａ，１２ａに接合剤を介した状態で接合する工程と、接合したセラミックス成形体を焼成する工程とを備える。【選択図】図１
HOLLOW STRUCTURE MANUFACTURING METHOD AND HOLLOW STRUCTURE
中空構造体の製造方法及び中空構造体
NAKAMURA HIROAKI (author) / ASANO TOMOYUKI (author)
2016-05-09
Patent
Electronic Resource
Japanese
IPC:
C04B
Kalk
,
LIME
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