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BOND LAYER FOR SILICON-CONTAINING SUBSTRATES
PROBLEM TO BE SOLVED: To provide an article that may include a substrate and a coating on a substrate.SOLUTION: In accordance with some of these examples, the coating may include a bond layer and an overlying layer comprising at least one oxide. In some examples, the bond layer comprises silicon metal and at least one of a transition metal carbide, a transition metal boride, or a transition metal nitride.SELECTED DRAWING: Figure 1
【課題】いくつかの例において、物品は、基材、及び基材上のコーティングを含んでもよい。【解決手段】これらの例のいくつかによれば、コーティングは、結合層と、少なくとも一つの酸化物を含む上層とを含んでもよい。いくつかの例において、結合層は、シリコン金属と、遷移金属炭化物、遷移金属ホウ化物、又は遷移金属窒化物の少なくとも一つとを含む。【選択図】図1
BOND LAYER FOR SILICON-CONTAINING SUBSTRATES
PROBLEM TO BE SOLVED: To provide an article that may include a substrate and a coating on a substrate.SOLUTION: In accordance with some of these examples, the coating may include a bond layer and an overlying layer comprising at least one oxide. In some examples, the bond layer comprises silicon metal and at least one of a transition metal carbide, a transition metal boride, or a transition metal nitride.SELECTED DRAWING: Figure 1
【課題】いくつかの例において、物品は、基材、及び基材上のコーティングを含んでもよい。【解決手段】これらの例のいくつかによれば、コーティングは、結合層と、少なくとも一つの酸化物を含む上層とを含んでもよい。いくつかの例において、結合層は、シリコン金属と、遷移金属炭化物、遷移金属ホウ化物、又は遷移金属窒化物の少なくとも一つとを含む。【選択図】図1
BOND LAYER FOR SILICON-CONTAINING SUBSTRATES
シリコン含有基材のための結合層
SEAN E LANDWEHR (author) / LEE KANG N (author) / ADAM LEE CHAMBERLAIN (author)
2016-05-30
Patent
Electronic Resource
Japanese
IPC:
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
C04B
Kalk
,
LIME
/
C23C
Beschichten metallischer Werkstoffe
,
COATING METALLIC MATERIAL
/
F01D
Strömungsmaschinen [Kraft- und Arbeitsmaschinen oder Kraftmaschinen], z.B. Dampfturbinen
,
NON-POSITIVE-DISPLACEMENT MACHINES OR ENGINES, e.g. STEAM TURBINES
/
F02C
Gasturbinenanlagen
,
GAS-TURBINE PLANTS
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