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BOND LAYER FOR SILICON-CONTAINING SUBSTRATES
In some examples, an article may include a substrate and a coating on the substrate. In accordance with some of these examples, the coating may include a bond layer and an overlying layer comprising at least one oxide. In some examples, the bond layer comprises silicon metal and at least one of a transition metal carbide, a transition metal boride, or a transition metal nitride.
BOND LAYER FOR SILICON-CONTAINING SUBSTRATES
In some examples, an article may include a substrate and a coating on the substrate. In accordance with some of these examples, the coating may include a bond layer and an overlying layer comprising at least one oxide. In some examples, the bond layer comprises silicon metal and at least one of a transition metal carbide, a transition metal boride, or a transition metal nitride.
BOND LAYER FOR SILICON-CONTAINING SUBSTRATES
LANDWEHR SEAN E (author) / LEE KANG N (author) / CHAMBERLAIN ADAM LEE (author)
2016-05-26
Patent
Electronic Resource
English
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