A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
COMPOSITE FILLER AND THERMOSETTING MATERIAL
PROBLEM TO BE SOLVED: To provide a composite filler and a thermosetting material which can improve thermal conductivity.SOLUTION: The present invention provides a composite filler that comprises a plurality of boron nitride particles, and a silicon carbide binder binding the plurality of boron nitride particles, and also provides a thermosetting material that comprises a thermosetting compound having the composite filler added thereto. In the composite filler, an average spectrum ratio is 2 or less, an average particle diameter is 1-100 μm, an average compressive modulus of elasticity is 5000 N/mmin 10% compression, and 3000 N/mmin 30% compression.SELECTED DRAWING: Figure 1
【課題】熱伝導性を高めることができる複合フィラー及び熱硬化性材料の提供。【解決手段】複数の窒化ホウ素粒子と、複数の前記窒化ホウ素粒子を結着しているシリコンカーバイド結着剤とを備える複合フィラー、さらには複合フィラーを添加した熱硬化性化合物からなる熱硬化性材料。平均スペクトル比が２以下で、平均粒子径が１〜１００μｍであり、平均圧縮弾性率が１０％圧縮の時で５０００Ｎ／ｍｍ２であり、３０％圧縮した時で３０００Ｎ／ｍｍ２である複合フィラー。【選択図】図１
COMPOSITE FILLER AND THERMOSETTING MATERIAL
PROBLEM TO BE SOLVED: To provide a composite filler and a thermosetting material which can improve thermal conductivity.SOLUTION: The present invention provides a composite filler that comprises a plurality of boron nitride particles, and a silicon carbide binder binding the plurality of boron nitride particles, and also provides a thermosetting material that comprises a thermosetting compound having the composite filler added thereto. In the composite filler, an average spectrum ratio is 2 or less, an average particle diameter is 1-100 μm, an average compressive modulus of elasticity is 5000 N/mmin 10% compression, and 3000 N/mmin 30% compression.SELECTED DRAWING: Figure 1
【課題】熱伝導性を高めることができる複合フィラー及び熱硬化性材料の提供。【解決手段】複数の窒化ホウ素粒子と、複数の前記窒化ホウ素粒子を結着しているシリコンカーバイド結着剤とを備える複合フィラー、さらには複合フィラーを添加した熱硬化性化合物からなる熱硬化性材料。平均スペクトル比が２以下で、平均粒子径が１〜１００μｍであり、平均圧縮弾性率が１０％圧縮の時で５０００Ｎ／ｍｍ２であり、３０％圧縮した時で３０００Ｎ／ｍｍ２である複合フィラー。【選択図】図１
COMPOSITE FILLER AND THERMOSETTING MATERIAL
複合フィラー及び熱硬化性材料
SON HITONORI (author) / OWASHI KEIGO (author) / ASHIBA GOJI (author) / SANO MASAMI (author)
2017-07-27
Patent
Electronic Resource
Japanese
IPC:
C01B
NON-METALLIC ELEMENTS
,
Nichtmetallische Elemente
/
C04B
Kalk
,
LIME
/
C08K
Verwendung von anorganischen oder nichtmakromolekularen organischen Stoffen als Zusatzstoffe
,
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
/
C08L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
,
Massen auf Basis makromolekularer Verbindungen
A self-healing thermosetting composite material
| British Library Online Contents | 2007
| European Patent Office | 2022
Inorganic filler and application thereof on thermosetting non-combustible polystyrene board
| European Patent Office | 2015
The Laminated Composite Thermosetting Pipe
| British Library Conference Proceedings | 2014
The Electrical Behavior of Thermosetting Polymer Composites Containing Metal Plated Ceramic Filler
| British Library Online Contents | 2005