A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
CONDUCTIVE ADHESIVE COMPOSITION FOR WATERPROOF CONSTRUCTION AND WATERPROOF STRUCTURE
PROBLEM TO BE SOLVED: To provide a waterproof structure which can be easily formed at a construction site, and can inspect flaws such as pin holes with a high voltage type flaw detector, and to provide a conductive adhesive composition for waterproof construction used for formation of the waterproof structure.SOLUTION: A conductive adhesive composition for waterproof construction contains an adhesive component and a conductive filler, where a surface electric resistance as measured according to JIS K 6911 of the conductive adhesive composition is 1×10to 1×10Ω. The adhesive component is preferably at least one selected from the group consisting of an epoxy-based component, an urethane-based component, an asphalt-based component, an acrylic component, a styrene butadiene-based component, a chloroprene-based component, a nitrile-based component, a silicone-based component and a modified-silicone-based component. The conductive filler is preferably at least one selected from the group consisting of a metal oxide, metal, a conductive polymer and carbon black. The waterproof structure is formed by stacking a waterproof layer on a conductive adhesive layer formed from the conductive adhesive composition.SELECTED DRAWING: Figure 1
【課題】施工現場で容易に形成することができる、高電圧式探傷器でピンホール等の傷の検査ができる防水構造、およびその防水構造の形成に用いる防水施工用導電性接着剤組成物を提供する。【解決手段】接着剤成分と導電フィラーとを含む防水施工用導電性接着剤組成物であって、該導電性接着剤組成物のＪＩＳ Ｋ６９１１に従って測定した表面電気抵抗が１×１０1〜１×１０8Ωであるものを用いる。接着剤成分は、好ましくは、エポキシ系、ウレタン系、アスファルト系、アクリル系、スチレンブタジエン系、クロロプレン系、ニトリル系、シリコーン系および変性シリコーン系からなる群から選ばれる少なくとも１種である。導電フィラーは、好ましくは、金属酸化物、金属、導電性高分子およびカーボンブラックからなる群から選ばれる少なくとも１種である。防水構造は、前記導電性接着剤組成物からなる導電性接着剤層の上に防水層を積層してなる。【選択図】図１
CONDUCTIVE ADHESIVE COMPOSITION FOR WATERPROOF CONSTRUCTION AND WATERPROOF STRUCTURE
PROBLEM TO BE SOLVED: To provide a waterproof structure which can be easily formed at a construction site, and can inspect flaws such as pin holes with a high voltage type flaw detector, and to provide a conductive adhesive composition for waterproof construction used for formation of the waterproof structure.SOLUTION: A conductive adhesive composition for waterproof construction contains an adhesive component and a conductive filler, where a surface electric resistance as measured according to JIS K 6911 of the conductive adhesive composition is 1×10to 1×10Ω. The adhesive component is preferably at least one selected from the group consisting of an epoxy-based component, an urethane-based component, an asphalt-based component, an acrylic component, a styrene butadiene-based component, a chloroprene-based component, a nitrile-based component, a silicone-based component and a modified-silicone-based component. The conductive filler is preferably at least one selected from the group consisting of a metal oxide, metal, a conductive polymer and carbon black. The waterproof structure is formed by stacking a waterproof layer on a conductive adhesive layer formed from the conductive adhesive composition.SELECTED DRAWING: Figure 1
【課題】施工現場で容易に形成することができる、高電圧式探傷器でピンホール等の傷の検査ができる防水構造、およびその防水構造の形成に用いる防水施工用導電性接着剤組成物を提供する。【解決手段】接着剤成分と導電フィラーとを含む防水施工用導電性接着剤組成物であって、該導電性接着剤組成物のＪＩＳ Ｋ６９１１に従って測定した表面電気抵抗が１×１０1〜１×１０8Ωであるものを用いる。接着剤成分は、好ましくは、エポキシ系、ウレタン系、アスファルト系、アクリル系、スチレンブタジエン系、クロロプレン系、ニトリル系、シリコーン系および変性シリコーン系からなる群から選ばれる少なくとも１種である。導電フィラーは、好ましくは、金属酸化物、金属、導電性高分子およびカーボンブラックからなる群から選ばれる少なくとも１種である。防水構造は、前記導電性接着剤組成物からなる導電性接着剤層の上に防水層を積層してなる。【選択図】図１
CONDUCTIVE ADHESIVE COMPOSITION FOR WATERPROOF CONSTRUCTION AND WATERPROOF STRUCTURE
防水施工用導電性接着剤組成物および防水構造
TAMARU HIROAKI (author) / KAMEI MASAHIRO (author) / ABE KAZUHIRO (author)
2018-07-26
Patent
Electronic Resource
Japanese
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