A platform for research: civil engineering, architecture and urbanism
FLOOR HEAT INSULATION STRUCTURE
PROBLEM TO BE SOLVED: To provide a floor heat insulation structure that may not affect the ventilation characteristic of ventilation packing provided on the groundsill side even in such a manner that a heat insulation material is also disposed on the underside of sleeper.SOLUTION: The floor heat insulation structure comprises: first heat insulation materials 10 that are disposed, respectively, between a groundsill 2 placed on a foundation 1 and a sleeper 3 adjacently provided thereto, and between the sleepers 3 adjacent to each other; second heat insulation materials 20 where their top faces 20a are disposed on undersides 10b of the first heat insulation materials 10 and also disposed on the underside 3b of the sleeper 3, and the position of undersides 20b are disposed so as to locate on upper side than the position of ventilation packing 4 provided on the groundsill 2 side; and fixation pins 30a that are fixed at the groundsill 2 and the sleeper 3 respectively, and support the second heat insulation materials 20.SELECTED DRAWING: Figure 1
【課題】大引の下面にも断熱材を配設するようにしても、土台側に設けられる通気パッキンの通気性に影響を及ぼすことのない床断熱構造を提供する。【解決手段】基礎1に載置されている土台2とその土台2に隣接して設けられている大引3との間、及び隣り合う大引3同士の間にそれぞれ配設される第1の断熱材10と、上面20aが第1の断熱材10の下面10bに配設されているとともに、大引3の下面3bに配設され、かつ下面20bの位置が土台2側に設けられている通気パッキン4の位置より上側に位置するように配設される第2の断熱材20と、土台2及び大引3にそれぞれ固定され、第2の断熱材20を支持する固定ピン30aとからなることを特徴としている。【選択図】図1
FLOOR HEAT INSULATION STRUCTURE
PROBLEM TO BE SOLVED: To provide a floor heat insulation structure that may not affect the ventilation characteristic of ventilation packing provided on the groundsill side even in such a manner that a heat insulation material is also disposed on the underside of sleeper.SOLUTION: The floor heat insulation structure comprises: first heat insulation materials 10 that are disposed, respectively, between a groundsill 2 placed on a foundation 1 and a sleeper 3 adjacently provided thereto, and between the sleepers 3 adjacent to each other; second heat insulation materials 20 where their top faces 20a are disposed on undersides 10b of the first heat insulation materials 10 and also disposed on the underside 3b of the sleeper 3, and the position of undersides 20b are disposed so as to locate on upper side than the position of ventilation packing 4 provided on the groundsill 2 side; and fixation pins 30a that are fixed at the groundsill 2 and the sleeper 3 respectively, and support the second heat insulation materials 20.SELECTED DRAWING: Figure 1
【課題】大引の下面にも断熱材を配設するようにしても、土台側に設けられる通気パッキンの通気性に影響を及ぼすことのない床断熱構造を提供する。【解決手段】基礎1に載置されている土台2とその土台2に隣接して設けられている大引3との間、及び隣り合う大引3同士の間にそれぞれ配設される第1の断熱材10と、上面20aが第1の断熱材10の下面10bに配設されているとともに、大引3の下面3bに配設され、かつ下面20bの位置が土台2側に設けられている通気パッキン4の位置より上側に位置するように配設される第2の断熱材20と、土台2及び大引3にそれぞれ固定され、第2の断熱材20を支持する固定ピン30aとからなることを特徴としている。【選択図】図1
FLOOR HEAT INSULATION STRUCTURE
床断熱構造
HIRABAYASHI SHINSUKE (author) / TOOYAMA MASAKI (author)
2018-09-20
Patent
Electronic Resource
Japanese
IPC:
E04B
Allgemeine Baukonstruktionen
,
GENERAL BUILDING CONSTRUCTIONS
HEAT INSULATION FLOOR MODIFICATION METHOD AND HEAT INSULATION FLOOR STRUCTURE
European Patent Office | 2015
|FLOOR HEAT INSULATION STRUCTURE AND FLOOR HEAT INSULATION MATERIAL CONSTRUCTION METHOD
European Patent Office | 2020
|European Patent Office | 2020
|