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HEAT INSULATION CAP AND FLOOR STRUCTURE
To provide a heat insulation cap used for a floor structure for laying floor finish material on an underfloor having a through hole formed in an upper part of a floor bundle, which is capable of preventing a floor finish material from being caved or cracked right above a through hole and is excellent in workability at low cost, and a floor structure using the heat insulation cap.SOLUTION: A heat insulation cap 1 is a heat insulation cap 1 which covers an upper part of a floor bundle 3 which exposes the upper part through a through hole 50 provided in an underfloor 5 and supports the underfloor 5, and comprises a core material 11 having a cylindrical shape extending in a vertical direction and having an upper portion of the floor bundle 3 inserted therein and a lower end supported by the floor bundle 3, tubular first heat insulation material 12 provided around an outer periphery of the core material 11, and a second heat insulation material 13 which is covering the upper end of the core material 11 and the first heat insulation material 12 and closing a center hole of the core material 11 and which is harder than the first heat insulation material 12 whose upper surface is flush with the upper surface of the underfloor 5.SELECTED DRAWING: Figure 5
【課題】 床束上部に貫通孔が形成された床下地の上に床仕上材を敷設する床構造に用いる断熱キャップであって、貫通孔の直上の床仕上材の陥没や割れを防止でき、低コストで施工性に優れた断熱キャップ及び当該断熱キャップを用いた床構造を提供する。【解決手段】断熱キャップ1は、当該床下地5に設けられた貫通孔50を通じて上部が露出するとともに前記床下地5を支持する床束3の前記上部を覆う断熱キャップ1であって、上下方向に延びる筒状で内部に前記床束3の上部が挿入され、下端が前記床束3に支持される芯材11と、前記芯材11の外周廻りに設けられる筒状の第一断熱材12と、前記芯材11及び前記第一断熱材12の上端を覆うとともに前記芯材11の中心孔を塞ぐ平板状で、上面が前記床下地5の上面と面一となる前記第一断熱材12よりも硬質な第二断熱材13と、を備える。【選択図】図5
HEAT INSULATION CAP AND FLOOR STRUCTURE
To provide a heat insulation cap used for a floor structure for laying floor finish material on an underfloor having a through hole formed in an upper part of a floor bundle, which is capable of preventing a floor finish material from being caved or cracked right above a through hole and is excellent in workability at low cost, and a floor structure using the heat insulation cap.SOLUTION: A heat insulation cap 1 is a heat insulation cap 1 which covers an upper part of a floor bundle 3 which exposes the upper part through a through hole 50 provided in an underfloor 5 and supports the underfloor 5, and comprises a core material 11 having a cylindrical shape extending in a vertical direction and having an upper portion of the floor bundle 3 inserted therein and a lower end supported by the floor bundle 3, tubular first heat insulation material 12 provided around an outer periphery of the core material 11, and a second heat insulation material 13 which is covering the upper end of the core material 11 and the first heat insulation material 12 and closing a center hole of the core material 11 and which is harder than the first heat insulation material 12 whose upper surface is flush with the upper surface of the underfloor 5.SELECTED DRAWING: Figure 5
【課題】 床束上部に貫通孔が形成された床下地の上に床仕上材を敷設する床構造に用いる断熱キャップであって、貫通孔の直上の床仕上材の陥没や割れを防止でき、低コストで施工性に優れた断熱キャップ及び当該断熱キャップを用いた床構造を提供する。【解決手段】断熱キャップ1は、当該床下地5に設けられた貫通孔50を通じて上部が露出するとともに前記床下地5を支持する床束3の前記上部を覆う断熱キャップ1であって、上下方向に延びる筒状で内部に前記床束3の上部が挿入され、下端が前記床束3に支持される芯材11と、前記芯材11の外周廻りに設けられる筒状の第一断熱材12と、前記芯材11及び前記第一断熱材12の上端を覆うとともに前記芯材11の中心孔を塞ぐ平板状で、上面が前記床下地5の上面と面一となる前記第一断熱材12よりも硬質な第二断熱材13と、を備える。【選択図】図5
HEAT INSULATION CAP AND FLOOR STRUCTURE
断熱キャップ及び床構造
TO MASAAKI (author) / TAMAI SHINJI (author)
2018-12-20
Patent
Electronic Resource
Japanese
IPC:
E04F
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
,
Ausbau von Bauwerken, z.B. Treppen, Fußböden
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