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COPPER/CERAMIC JOINT, INSULATION CIRCUIT BOARD, AND MANUFACTURING METHOD FOR COPPER/CERAMIC JOINT, MANUFACTURING METHOD FOR INSULATION CIRCUIT BOARD
To provide a copper/ceramic joint in which a copper member composed of copper or copper alloy and a ceramic member composed of aluminum oxide are reliably joined and excellent in migration resistance, an insulation circuit board, and a manufacturing method for the copper/ceramic joint, and a manufacturing method for the insulation circuit board.SOLUTION: A copper/ceramic joint is obtained by joining a copper member 12 composed of copper or copper alloy and a ceramic member 11 composed of aluminum oxide. In between the copper member 12 and the ceramic member 11, a magnesium oxide layer 31 is formed at the ceramic member 11 side, and a Mg solid solution layer 32, in which Mg is solid-dissolved in a parent phase of Cu, is formed between the magnesium oxide layer 31 and the copper member 12. One or more active metals selected from Ti, Zr, Nb, Hf are present in the Mg solid solution layer 32.SELECTED DRAWING: Figure 2
【課題】銅又は銅合金からなる銅部材とアルミニウム酸化物からなるセラミックス部材とが確実に接合され、耐マイグレーション性に優れた銅／セラミックス接合体、絶縁回路基板、及び、上述の銅／セラミックス接合体の製造方法、絶縁回路基板の製造方法を提供する。【解決手段】銅又は銅合金からなる銅部材１２と、アルミニウム酸化物からなるセラミックス部材１１とが接合されてなる銅／セラミックス接合体であって、銅部材１２とセラミックス部材１１との間においては、セラミックス部材１１側に酸化マグネシウム層３１が形成され、この酸化マグネシウム層３１と銅部材１２との間にＣｕの母相中にＭｇが固溶したＭｇ固溶層３２が形成されており、Ｍｇ固溶層３２には、Ｔｉ，Ｚｒ，Ｎｂ，Ｈｆから選択される１種又は２種以上の活性金属が存在する。【選択図】図２
COPPER/CERAMIC JOINT, INSULATION CIRCUIT BOARD, AND MANUFACTURING METHOD FOR COPPER/CERAMIC JOINT, MANUFACTURING METHOD FOR INSULATION CIRCUIT BOARD
To provide a copper/ceramic joint in which a copper member composed of copper or copper alloy and a ceramic member composed of aluminum oxide are reliably joined and excellent in migration resistance, an insulation circuit board, and a manufacturing method for the copper/ceramic joint, and a manufacturing method for the insulation circuit board.SOLUTION: A copper/ceramic joint is obtained by joining a copper member 12 composed of copper or copper alloy and a ceramic member 11 composed of aluminum oxide. In between the copper member 12 and the ceramic member 11, a magnesium oxide layer 31 is formed at the ceramic member 11 side, and a Mg solid solution layer 32, in which Mg is solid-dissolved in a parent phase of Cu, is formed between the magnesium oxide layer 31 and the copper member 12. One or more active metals selected from Ti, Zr, Nb, Hf are present in the Mg solid solution layer 32.SELECTED DRAWING: Figure 2
【課題】銅又は銅合金からなる銅部材とアルミニウム酸化物からなるセラミックス部材とが確実に接合され、耐マイグレーション性に優れた銅／セラミックス接合体、絶縁回路基板、及び、上述の銅／セラミックス接合体の製造方法、絶縁回路基板の製造方法を提供する。【解決手段】銅又は銅合金からなる銅部材１２と、アルミニウム酸化物からなるセラミックス部材１１とが接合されてなる銅／セラミックス接合体であって、銅部材１２とセラミックス部材１１との間においては、セラミックス部材１１側に酸化マグネシウム層３１が形成され、この酸化マグネシウム層３１と銅部材１２との間にＣｕの母相中にＭｇが固溶したＭｇ固溶層３２が形成されており、Ｍｇ固溶層３２には、Ｔｉ，Ｚｒ，Ｎｂ，Ｈｆから選択される１種又は２種以上の活性金属が存在する。【選択図】図２
COPPER/CERAMIC JOINT, INSULATION CIRCUIT BOARD, AND MANUFACTURING METHOD FOR COPPER/CERAMIC JOINT, MANUFACTURING METHOD FOR INSULATION CIRCUIT BOARD
銅／セラミックス接合体、絶縁回路基板、及び、銅／セラミックス接合体の製造方法、絶縁回路基板の製造方法
TERASAKI NOBUYUKI (author)
2019-08-01
Patent
Electronic Resource
Japanese
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