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COPPER/CERAMIC ASSEMBLY, INSULATION CIRCUIT BOARD, METHOD FOR MANUFACTURING COPPER/CERAMIC ASSEMBLY, AND METHOD FOR MANUFACTURING INSULATION CIRCUIT BOARD
To provide a copper/ceramic assembly which can suppress occurrence of cracking of a ceramic substrate and is excellent in cooling/heating cycle reliability even when severe cooling/heating cycle load is performed, an insulation circuit board, a method for manufacturing a copper/ceramic assembly, and a method for manufacturing an insulation circuit board.SOLUTION: A copper/ceramic assembly is constituted by joining a copper member 12 composed of copper or a copper alloy and a ceramic member 11 composed of nitrogen-containing ceramic. An active metal nitride layer 41 containing a nitride of one or two or more kinds of active metal selected from Ti, Zr, Nb and Hf is formed on the side of the ceramic member 11 between the copper member 12 and the ceramic member 11. An Mg solid solution layer 45 in which Mg is solid-dissolved in a parent phase of Cu is formed between the active metal nitride layer 41 and the copper member 12, and Cu-containing particles 42 composed of either or both of Cu particles and compound particles of Cu and active metal are dispersed inside the active metal nitride layer 41.SELECTED DRAWING: Figure 3
【課題】厳しい冷熱サイクルを負荷した場合であっても、セラミックス基板の割れの発生を抑制でき、冷熱サイクル信頼性に優れた銅／セラミックス接合体、絶縁回路基板、及び、銅／セラミックス接合体の製造方法、絶縁回路基板の製造方法を提供する。【解決手段】銅又は銅合金からなる銅部材１２と、窒素含有セラミックスからなるセラミックス部材１１とが接合されてなる銅／セラミックス接合体であって、銅部材１２とセラミックス部材１１との間においては、セラミックス部材１１側にＴｉ，Ｚｒ，Ｎｂ，Ｈｆから選択される１種又は２種以上の活性金属の窒化物を含む活性金属窒化物層４１が形成され、この活性金属窒化物層４１と銅部材１２との間にＣｕの母相中にＭｇが固溶したＭｇ固溶層４５が形成されており、活性金属窒化物層４１の内部に、Ｃｕ粒子及びＣｕと活性金属の化合物粒子のいずれか一方又は両方からなるＣｕ含有粒子４２が分散されている。【選択図】図３
COPPER/CERAMIC ASSEMBLY, INSULATION CIRCUIT BOARD, METHOD FOR MANUFACTURING COPPER/CERAMIC ASSEMBLY, AND METHOD FOR MANUFACTURING INSULATION CIRCUIT BOARD
To provide a copper/ceramic assembly which can suppress occurrence of cracking of a ceramic substrate and is excellent in cooling/heating cycle reliability even when severe cooling/heating cycle load is performed, an insulation circuit board, a method for manufacturing a copper/ceramic assembly, and a method for manufacturing an insulation circuit board.SOLUTION: A copper/ceramic assembly is constituted by joining a copper member 12 composed of copper or a copper alloy and a ceramic member 11 composed of nitrogen-containing ceramic. An active metal nitride layer 41 containing a nitride of one or two or more kinds of active metal selected from Ti, Zr, Nb and Hf is formed on the side of the ceramic member 11 between the copper member 12 and the ceramic member 11. An Mg solid solution layer 45 in which Mg is solid-dissolved in a parent phase of Cu is formed between the active metal nitride layer 41 and the copper member 12, and Cu-containing particles 42 composed of either or both of Cu particles and compound particles of Cu and active metal are dispersed inside the active metal nitride layer 41.SELECTED DRAWING: Figure 3
【課題】厳しい冷熱サイクルを負荷した場合であっても、セラミックス基板の割れの発生を抑制でき、冷熱サイクル信頼性に優れた銅／セラミックス接合体、絶縁回路基板、及び、銅／セラミックス接合体の製造方法、絶縁回路基板の製造方法を提供する。【解決手段】銅又は銅合金からなる銅部材１２と、窒素含有セラミックスからなるセラミックス部材１１とが接合されてなる銅／セラミックス接合体であって、銅部材１２とセラミックス部材１１との間においては、セラミックス部材１１側にＴｉ，Ｚｒ，Ｎｂ，Ｈｆから選択される１種又は２種以上の活性金属の窒化物を含む活性金属窒化物層４１が形成され、この活性金属窒化物層４１と銅部材１２との間にＣｕの母相中にＭｇが固溶したＭｇ固溶層４５が形成されており、活性金属窒化物層４１の内部に、Ｃｕ粒子及びＣｕと活性金属の化合物粒子のいずれか一方又は両方からなるＣｕ含有粒子４２が分散されている。【選択図】図３
COPPER/CERAMIC ASSEMBLY, INSULATION CIRCUIT BOARD, METHOD FOR MANUFACTURING COPPER/CERAMIC ASSEMBLY, AND METHOD FOR MANUFACTURING INSULATION CIRCUIT BOARD
銅／セラミックス接合体、絶縁回路基板、及び、銅／セラミックス接合体の製造方法、絶縁回路基板の製造方法
TERASAKI NOBUYUKI (author)
2021-06-17
Patent
Electronic Resource
Japanese
| European Patent Office | 2021
| European Patent Office | 2019