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JOINING METHOD OF DISSIMILAR MATERIAL, AND JOINED BODY OF DISSIMILAR MATERIAL
To reduce the maximum value of thermal stress generated by difference of a liner expansion coefficient, when joining a first substrate to a second substrate.SOLUTION: In a joining method of dissimilar materials for joining through a functionally graded layer 3, a first substrate 1 comprising a metal to a second substrate 2 comprising a metal or a ceramic having a liner expansion coefficient different from that of the first substrate 1, the functionally graded layer 3, in which a plurality of open holes 4 are formed, has a liner expansion coefficient changing gradually in a thickness direction between the liner expansion coefficient of one substrate and the liner expansion coefficient of the other substrate.SELECTED DRAWING: Figure 1
【課題】第1の基材と第2の基材を接合する場合において、線膨張係数差によって発生する熱応力の最大値を低減させることにある。【解決手段】金属から成る第1の基材1と、この第1の基材1と線膨張係数が相違する金属またはセラミックスから成る第2の基材2とを、傾斜機能層3を介して接合する異種材料の接合方法において、前記傾斜機能層3は、複数の貫通孔4を形成することによって一方の基材の線膨張係数と他方の基材の線膨張係数の間で厚さ方向に段階的に変化する線膨張係数を有することを特徴とする。【選択図】図1
JOINING METHOD OF DISSIMILAR MATERIAL, AND JOINED BODY OF DISSIMILAR MATERIAL
To reduce the maximum value of thermal stress generated by difference of a liner expansion coefficient, when joining a first substrate to a second substrate.SOLUTION: In a joining method of dissimilar materials for joining through a functionally graded layer 3, a first substrate 1 comprising a metal to a second substrate 2 comprising a metal or a ceramic having a liner expansion coefficient different from that of the first substrate 1, the functionally graded layer 3, in which a plurality of open holes 4 are formed, has a liner expansion coefficient changing gradually in a thickness direction between the liner expansion coefficient of one substrate and the liner expansion coefficient of the other substrate.SELECTED DRAWING: Figure 1
【課題】第1の基材と第2の基材を接合する場合において、線膨張係数差によって発生する熱応力の最大値を低減させることにある。【解決手段】金属から成る第1の基材1と、この第1の基材1と線膨張係数が相違する金属またはセラミックスから成る第2の基材2とを、傾斜機能層3を介して接合する異種材料の接合方法において、前記傾斜機能層3は、複数の貫通孔4を形成することによって一方の基材の線膨張係数と他方の基材の線膨張係数の間で厚さ方向に段階的に変化する線膨張係数を有することを特徴とする。【選択図】図1
JOINING METHOD OF DISSIMILAR MATERIAL, AND JOINED BODY OF DISSIMILAR MATERIAL
異種材料の接合方法および異種材料の接合体
TAZAWA TOSHIYUKI (author) / TADANO SATOSHI (author) / ARAKI SHOTA (author)
2019-11-28
Patent
Electronic Resource
Japanese
Joining dissimilar material combinations: materials and processes
British Library Online Contents | 1995
|Joining dissimilar material combinations: materials and processes
British Library Online Contents | 1995
|