A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
METHOD OF INCREASING ADHESIVE STRENGTH BETWEEN CERAMIC MOUNTING PLATE AND THICK FILM CIRCUIT
To provide a method of combining thick film screen printing with a ceramic-metal eutectic phase process, including a method of improving adhesion.SOLUTION: A circuit pattern is printed on the surface of a ceramic mounting plate by a thick film screen printing circuit method by mainly using a metal conductive paste material or its oxide paste material, the ceramic mounting plate 3 is installed in an oven with an atmosphere in which the temperature can be controlled by a program, an environmental atmosphere condition is set to positive pressure inert gas containing nitrogen gas, hydrogen gas, or nitrogen/hydrogen mixed gas, and an eutectic phase 7 is generated between the ceramic mounting plate and a metal circuit through the high temperature eutectic condition, thereby enhancing the adhesive force between the ceramic mounting plate 3 and a thick film circuit 4.SELECTED DRAWING: Figure 2
【課題】接着力を改善する方法を含む、厚膜スクリーン印刷とセラミックス−金属共晶相工程を組み合わせた方法を提供する。【解決手段】主に金属導電ペースト材またはその酸化物のペースト材を用いて、厚膜スクリーン印刷回路方式によって、回路パターンをセラミックス搭載板の表面に印刷し、さらにセラミックス搭載板３をプログラムによる温度制御が可能な雰囲気のオーブンに設置し、環境雰囲気条件を窒素ガス、水素ガスまたは窒素／水素混合ガスを含む正圧の不活性ガスに設定し、高温共晶条件を経て、セラミックス搭載板と金属回路の間に共晶相７を生成させることで、セラミックス搭載板３と厚膜回路４との接着力を高める。【選択図】図２
METHOD OF INCREASING ADHESIVE STRENGTH BETWEEN CERAMIC MOUNTING PLATE AND THICK FILM CIRCUIT
To provide a method of combining thick film screen printing with a ceramic-metal eutectic phase process, including a method of improving adhesion.SOLUTION: A circuit pattern is printed on the surface of a ceramic mounting plate by a thick film screen printing circuit method by mainly using a metal conductive paste material or its oxide paste material, the ceramic mounting plate 3 is installed in an oven with an atmosphere in which the temperature can be controlled by a program, an environmental atmosphere condition is set to positive pressure inert gas containing nitrogen gas, hydrogen gas, or nitrogen/hydrogen mixed gas, and an eutectic phase 7 is generated between the ceramic mounting plate and a metal circuit through the high temperature eutectic condition, thereby enhancing the adhesive force between the ceramic mounting plate 3 and a thick film circuit 4.SELECTED DRAWING: Figure 2
【課題】接着力を改善する方法を含む、厚膜スクリーン印刷とセラミックス−金属共晶相工程を組み合わせた方法を提供する。【解決手段】主に金属導電ペースト材またはその酸化物のペースト材を用いて、厚膜スクリーン印刷回路方式によって、回路パターンをセラミックス搭載板の表面に印刷し、さらにセラミックス搭載板３をプログラムによる温度制御が可能な雰囲気のオーブンに設置し、環境雰囲気条件を窒素ガス、水素ガスまたは窒素／水素混合ガスを含む正圧の不活性ガスに設定し、高温共晶条件を経て、セラミックス搭載板と金属回路の間に共晶相７を生成させることで、セラミックス搭載板３と厚膜回路４との接着力を高める。【選択図】図２
METHOD OF INCREASING ADHESIVE STRENGTH BETWEEN CERAMIC MOUNTING PLATE AND THICK FILM CIRCUIT
セラミックス搭載板と厚膜回路の接着力を高める方法
LIN CHIA-TING (author) / YAO JLIN-FUH (author) / LU CHUNG-YEN (author) / GUO YANG GUO (author)
2020-05-07
Patent
Electronic Resource
Japanese
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