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THERMALLY EXPANDABLE PUTTY COMPOSITION AND JOINT FILLER
To provide a thermally expandable putty composition, with which improvement of construction workability can be achieved.SOLUTION: The present invention provides a thermally expandable putty composition, comprising five ingredients that include an organic binder, a thermally expandable compound, inorganic particles, fibers, and water. When a total of the five components is taken as 100 mass%, an amount of addition of the organic binder is 0.5 to 15 mass%. Further, the present invention provides a joint filler using the thermally expandable putty composition.SELECTED DRAWING: None
【課題】施工作業性の向上が図られる熱膨張性パテ組成物を提供する。【解決手段】本発明によれば、有機バインダと、熱膨張性化合物と、無機粒子と、繊維と、水の5成分を含む熱膨張性パテ組成物であって、前記5成分の合計を100質量%としたときの有機バインダの配合量が0.5〜15質量%である、熱膨張性パテ組成物が提供される。さらに、本発明によれば、上記熱膨張性パテ組成物を用いた目地材が提供される。【選択図】なし
THERMALLY EXPANDABLE PUTTY COMPOSITION AND JOINT FILLER
To provide a thermally expandable putty composition, with which improvement of construction workability can be achieved.SOLUTION: The present invention provides a thermally expandable putty composition, comprising five ingredients that include an organic binder, a thermally expandable compound, inorganic particles, fibers, and water. When a total of the five components is taken as 100 mass%, an amount of addition of the organic binder is 0.5 to 15 mass%. Further, the present invention provides a joint filler using the thermally expandable putty composition.SELECTED DRAWING: None
【課題】施工作業性の向上が図られる熱膨張性パテ組成物を提供する。【解決手段】本発明によれば、有機バインダと、熱膨張性化合物と、無機粒子と、繊維と、水の5成分を含む熱膨張性パテ組成物であって、前記5成分の合計を100質量%としたときの有機バインダの配合量が0.5〜15質量%である、熱膨張性パテ組成物が提供される。さらに、本発明によれば、上記熱膨張性パテ組成物を用いた目地材が提供される。【選択図】なし
THERMALLY EXPANDABLE PUTTY COMPOSITION AND JOINT FILLER
熱膨張性パテ組成物及び目地材
TAKATSU TOMOMICHI (author) / SOMA HIDEYA (author)
2021-01-14
Patent
Electronic Resource
Japanese
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