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HEAT EXPANDABLE PUTTY COMPOSITION AND JOINT MATERIAL
To provide a heat expandable putty composition being excellent in heat expandable properties, shape stability after heat expansion, and shape stability after dry.SOLUTION: There is provided a heat expandable putty composition comprising: an inorganic based clay mineral; heat expandable graphite; and an inorganic compound other than the inorganic based clay mineral and the heat expandable graphite. With respect to total 100 pts.wt. of the inorganic based clay mineral, the heat expandable graphite, and the other inorganic compound, a content of the inorganic based clay mineral is 4.0 to 30 pts.wt., a content of the heat expandable graphite is 1.0 to 50 pts.wt., and a content of the other inorganic compound is 21 to 94 pts.wt., in the heat expandable putty composition.SELECTED DRAWING: None
【課題】熱膨張性、熱膨張後の形状安定性、及び乾燥後の形状安定性において優れる熱膨張性パテ組成物を提供すること。【解決手段】無機系粘土鉱物、熱膨張性黒鉛、前記無機系粘土鉱物及び前記熱膨張性黒鉛以外のその他の無機化合物、を含み、前記無機系粘土鉱物、前記熱膨張性黒鉛、及び前記その他の無機化合物の総量１００重量部に対して、前記無機系粘土鉱物の含有量が、４．０～３０重量部であり、前記熱膨張性黒鉛の含有量が、１．０～５０重量部であり、前記その他の無機化合物の含有量が、２１～９４重量部である、熱膨張性パテ組成物。【選択図】なし
HEAT EXPANDABLE PUTTY COMPOSITION AND JOINT MATERIAL
To provide a heat expandable putty composition being excellent in heat expandable properties, shape stability after heat expansion, and shape stability after dry.SOLUTION: There is provided a heat expandable putty composition comprising: an inorganic based clay mineral; heat expandable graphite; and an inorganic compound other than the inorganic based clay mineral and the heat expandable graphite. With respect to total 100 pts.wt. of the inorganic based clay mineral, the heat expandable graphite, and the other inorganic compound, a content of the inorganic based clay mineral is 4.0 to 30 pts.wt., a content of the heat expandable graphite is 1.0 to 50 pts.wt., and a content of the other inorganic compound is 21 to 94 pts.wt., in the heat expandable putty composition.SELECTED DRAWING: None
【課題】熱膨張性、熱膨張後の形状安定性、及び乾燥後の形状安定性において優れる熱膨張性パテ組成物を提供すること。【解決手段】無機系粘土鉱物、熱膨張性黒鉛、前記無機系粘土鉱物及び前記熱膨張性黒鉛以外のその他の無機化合物、を含み、前記無機系粘土鉱物、前記熱膨張性黒鉛、及び前記その他の無機化合物の総量１００重量部に対して、前記無機系粘土鉱物の含有量が、４．０～３０重量部であり、前記熱膨張性黒鉛の含有量が、１．０～５０重量部であり、前記その他の無機化合物の含有量が、２１～９４重量部である、熱膨張性パテ組成物。【選択図】なし
HEAT EXPANDABLE PUTTY COMPOSITION AND JOINT MATERIAL
熱膨張性パテ組成物、及び目地材
TAKATSU TOMOMICHI (author)
2023-08-10
Patent
Electronic Resource
Japanese
IPC:
C09K
Materialien für Anwendungen, soweit nicht anderweitig vorgesehen
,
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR
/
C09D
Überzugsmittel, z.B. Anstrichstoffe, Firnisse oder Lacke
,
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS
/
E04B
Allgemeine Baukonstruktionen
,
GENERAL BUILDING CONSTRUCTIONS
| European Patent Office | 2021