A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
POWDER MOLDED BODY AND FILLER POWDER
To provide a powder molded body in which the linear thermal expansion coefficient is lowered.SOLUTION: The powder molded body satisfies requirements 1 to 3. Requirement 1: the |dA(T)/dT| of the powder is 10 ppm/°C at at least one temperature of -200 to 1200°C. A is (a-axis lattice constant)/(c-axis lattice constant) and is obtained from X-ray diffraction measurement. Requirement 2: the powder contains at least one metallic or semi-metallic element, and the elements comprise only elements selected from the group consisting of Li, Na, Mg, Al, Si, K, Ca, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Rb, Sr, Y, Zr, Nb, Mo, Tc, Ag, Cd, In, Sn, Sb, Te, Cs, Ba, Hf, Ta, W, Re, Au, Hg, Tl, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu. Requirement 3: the linear thermal expansion coefficient of the molded body at -200 to 1200°C is negative at at least one temperature.SELECTED DRAWING: None
【課題】熱線膨張係数を低くする。【解決手段】粉体の成形体は要件１〜３を満たす。要件１：−２００〜１２００℃の少なくとも一つの温度で粉体の｜ｄＡ（Ｔ）／ｄＴ｜が１０ｐｐｍ／℃以上である。Ａは（ａ軸の格子定数）／（ｃ軸の格子定数）であり、Ｘ線回折測定から得られる。要件２：粉体が少なくとも一つの金属元素又は半金属元素を含み、当該元素は、Ｌｉ，Ｎａ，Ｍｇ，Ａｌ，Ｓｉ，Ｋ，Ｃａ，Ｓｃ、Ｔｉ，Ｖ，Ｃｒ，Ｍｎ、Ｆｅ，Ｃｏ，Ｎｉ，Ｃｕ，Ｚｎ，Ｇａ，Ｇｅ，Ｒｂ，Ｓｒ，Ｙ，Ｚｒ，Ｎｂ，Ｍｏ，Ｔｃ、Ａｇ，Ｃｄ，Ｉｎ，Ｓｎ，Ｓｂ，Ｔｅ，Ｃｓ，Ｂａ，Ｈｆ，Ｔａ，Ｗ，Ｒｅ，Ａｕ，Ｈｇ，Ｔｌ，Ｃｅ，Ｐｒ，Ｎｄ，Ｐｍ，Ｓｍ，Ｅｕ，Ｇｄ，Ｔｂ，Ｄｙ，Ｈｏ、Ｅｒ，Ｔｍ，Ｙｂ，及び、Ｌｕからなる群から選択される元素のみからなる。要件３：成形体の−２００〜１２００℃における熱線膨張係数が少なくとも一つの温度で負となる。【選択図】なし
POWDER MOLDED BODY AND FILLER POWDER
To provide a powder molded body in which the linear thermal expansion coefficient is lowered.SOLUTION: The powder molded body satisfies requirements 1 to 3. Requirement 1: the |dA(T)/dT| of the powder is 10 ppm/°C at at least one temperature of -200 to 1200°C. A is (a-axis lattice constant)/(c-axis lattice constant) and is obtained from X-ray diffraction measurement. Requirement 2: the powder contains at least one metallic or semi-metallic element, and the elements comprise only elements selected from the group consisting of Li, Na, Mg, Al, Si, K, Ca, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Rb, Sr, Y, Zr, Nb, Mo, Tc, Ag, Cd, In, Sn, Sb, Te, Cs, Ba, Hf, Ta, W, Re, Au, Hg, Tl, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu. Requirement 3: the linear thermal expansion coefficient of the molded body at -200 to 1200°C is negative at at least one temperature.SELECTED DRAWING: None
【課題】熱線膨張係数を低くする。【解決手段】粉体の成形体は要件１〜３を満たす。要件１：−２００〜１２００℃の少なくとも一つの温度で粉体の｜ｄＡ（Ｔ）／ｄＴ｜が１０ｐｐｍ／℃以上である。Ａは（ａ軸の格子定数）／（ｃ軸の格子定数）であり、Ｘ線回折測定から得られる。要件２：粉体が少なくとも一つの金属元素又は半金属元素を含み、当該元素は、Ｌｉ，Ｎａ，Ｍｇ，Ａｌ，Ｓｉ，Ｋ，Ｃａ，Ｓｃ、Ｔｉ，Ｖ，Ｃｒ，Ｍｎ、Ｆｅ，Ｃｏ，Ｎｉ，Ｃｕ，Ｚｎ，Ｇａ，Ｇｅ，Ｒｂ，Ｓｒ，Ｙ，Ｚｒ，Ｎｂ，Ｍｏ，Ｔｃ、Ａｇ，Ｃｄ，Ｉｎ，Ｓｎ，Ｓｂ，Ｔｅ，Ｃｓ，Ｂａ，Ｈｆ，Ｔａ，Ｗ，Ｒｅ，Ａｕ，Ｈｇ，Ｔｌ，Ｃｅ，Ｐｒ，Ｎｄ，Ｐｍ，Ｓｍ，Ｅｕ，Ｇｄ，Ｔｂ，Ｄｙ，Ｈｏ、Ｅｒ，Ｔｍ，Ｙｂ，及び、Ｌｕからなる群から選択される元素のみからなる。要件３：成形体の−２００〜１２００℃における熱線膨張係数が少なくとも一つの温度で負となる。【選択図】なし
POWDER MOLDED BODY AND FILLER POWDER
粉体の成形体、及び、フィラー粉体
DOI ATSUNORI (author) / SHIMANO SATORU (author)
2021-02-12
Patent
Electronic Resource
Japanese
| European Patent Office | 2017
TITANIUM OXIDE, POWDER, POWDER COMPOSITION, SOLID COMPOSITION, LIQUID COMPOSITION, AND MOLDED BODY
| European Patent Office | 2021