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BONDED BODY
To prevent removal of a bonding material from a metal member.SOLUTION: A bonded body comprises an electrochemical cell 10, a metal member 231, and a bonding material 12. The metal member 231 has an oxide film 25. The bonding material 12 bonds the electrochemical cell 10 and the metal member 231 to each other. The bonding material 12 has a first bonding part 121 and a second bonding part 122. The first bonding part 121 is bonded to the electrochemical cell 10. The second bonding part 122 is bonded to the metal member 231. The second bonding part 122 contains a diffusion element which is diffusible into the oxide film 25. The content of the diffusion element is lower in the first bonding part 121 than in the second bonding part 122.SELECTED DRAWING: Figure 9
【課題】金属部材に対する接合材の剥離を抑制する。【解決手段】接合体は、電気化学セル１０と、金属部材２３１と、接合材１２とを備える。金属部材２３１は、酸化被膜２５を有する。接合材１２は、電気化学セル１０と金属部材２３１とを接合する。接合材１２は、第１接合部１２１と第２接合部１２２とを有する。第１接合部１２１は、電気化学セル１０に接合する。第２接合部１２２は、金属部材２３１に接合する。第２接合部１２２は、酸化被膜２５内に拡散可能な拡散元素を含む。第１接合部１２１における拡散元素の含有率は、第２接合部１２２における拡散元素の含有率よりも低い。【選択図】図９
BONDED BODY
To prevent removal of a bonding material from a metal member.SOLUTION: A bonded body comprises an electrochemical cell 10, a metal member 231, and a bonding material 12. The metal member 231 has an oxide film 25. The bonding material 12 bonds the electrochemical cell 10 and the metal member 231 to each other. The bonding material 12 has a first bonding part 121 and a second bonding part 122. The first bonding part 121 is bonded to the electrochemical cell 10. The second bonding part 122 is bonded to the metal member 231. The second bonding part 122 contains a diffusion element which is diffusible into the oxide film 25. The content of the diffusion element is lower in the first bonding part 121 than in the second bonding part 122.SELECTED DRAWING: Figure 9
【課題】金属部材に対する接合材の剥離を抑制する。【解決手段】接合体は、電気化学セル１０と、金属部材２３１と、接合材１２とを備える。金属部材２３１は、酸化被膜２５を有する。接合材１２は、電気化学セル１０と金属部材２３１とを接合する。接合材１２は、第１接合部１２１と第２接合部１２２とを有する。第１接合部１２１は、電気化学セル１０に接合する。第２接合部１２２は、金属部材２３１に接合する。第２接合部１２２は、酸化被膜２５内に拡散可能な拡散元素を含む。第１接合部１２１における拡散元素の含有率は、第２接合部１２２における拡散元素の含有率よりも低い。【選択図】図９
BONDED BODY
接合体
IKEDO YUI (author) / TANAKA YUKI (author) / RYU TAKASHI (author) / OMORI MAKOTO (author)
2021-04-30
Patent
Electronic Resource
Japanese
BONDED BODY MANUFACTURING METHOD AND BONDED BODY MANUFACTURING DEVICE
| European Patent Office | 2021