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PLASMA-RESISTANT CERAMIC MEMBER AND MANUFACTURING METHOD THEREOF
To provide a plasma-resistant ceramic member which is excellent in plasma resistance and can be applied to a large-sized structure as a member for a large-sized semiconductor device, and a method for manufacturing the same.SOLUTION: A plasma-resistant ceramic member 100 comprises: a base material 110 formed of a ceramic sintered body containing Al2O3 as a main component; a plurality of ceramic substrates 120 formed of a ceramic sintered body containing YAG as a main component and adhered to a first surface 112 of the base material 110 so as to be adjacent to each other; and a thermal spraying film 130 formed of YAG or Y2O3 formed in a gap between the adjacent ceramic substrates 120 when the plurality of ceramic substrates 120 is viewed from the stacking direction of the base material 110 and the ceramic substrates 120.SELECTED DRAWING: Figure 1
【課題】耐プラズマ性に優れ、大型の半導体装置用の部材としての大型構造物にも適用できる耐プラズマセラミックス部材およびその製造方法を提供する。【解決手段】耐プラズマセラミックス部材１００であって、Ａｌ２Ｏ３を主成分とするセラミックス焼結体で形成される基材１１０と、ＹＡＧを主成分とするセラミックス焼結体で形成され、前記基材１１０の第１の表面１１２上に、互いに隣接するように接着される複数のセラミックス基板１２０と、前記基材１１０と前記セラミックス基板１２０との積層方向から前記複数のセラミックス基板１２０をみたときに、隣接する前記セラミックス基板１２０の間隙に形成されるＹＡＧまたはＹ２Ｏ３からなる溶射膜１３０と、を備える。【選択図】図１
PLASMA-RESISTANT CERAMIC MEMBER AND MANUFACTURING METHOD THEREOF
To provide a plasma-resistant ceramic member which is excellent in plasma resistance and can be applied to a large-sized structure as a member for a large-sized semiconductor device, and a method for manufacturing the same.SOLUTION: A plasma-resistant ceramic member 100 comprises: a base material 110 formed of a ceramic sintered body containing Al2O3 as a main component; a plurality of ceramic substrates 120 formed of a ceramic sintered body containing YAG as a main component and adhered to a first surface 112 of the base material 110 so as to be adjacent to each other; and a thermal spraying film 130 formed of YAG or Y2O3 formed in a gap between the adjacent ceramic substrates 120 when the plurality of ceramic substrates 120 is viewed from the stacking direction of the base material 110 and the ceramic substrates 120.SELECTED DRAWING: Figure 1
【課題】耐プラズマ性に優れ、大型の半導体装置用の部材としての大型構造物にも適用できる耐プラズマセラミックス部材およびその製造方法を提供する。【解決手段】耐プラズマセラミックス部材１００であって、Ａｌ２Ｏ３を主成分とするセラミックス焼結体で形成される基材１１０と、ＹＡＧを主成分とするセラミックス焼結体で形成され、前記基材１１０の第１の表面１１２上に、互いに隣接するように接着される複数のセラミックス基板１２０と、前記基材１１０と前記セラミックス基板１２０との積層方向から前記複数のセラミックス基板１２０をみたときに、隣接する前記セラミックス基板１２０の間隙に形成されるＹＡＧまたはＹ２Ｏ３からなる溶射膜１３０と、を備える。【選択図】図１
PLASMA-RESISTANT CERAMIC MEMBER AND MANUFACTURING METHOD THEREOF
耐プラズマセラミックス部材およびその製造方法
TSUCHIDA ATSUSHI (author) / TAKAHASHI YUKI (author) / TSUTAI YOSHIFUMI (author)
2022-09-06
Patent
Electronic Resource
Japanese
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