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INSTALLATION METHOD FOR PIPING AND WIRING
To provide an installation method for piping and wiring reduced in length of piping and wiring installed on the foundation of a building, in labor for installation, and reduced in load applied to the piping and wiring.SOLUTION: A foundation penetration member 1 forming a through-hole 10 for passing piping 200 installed on the foundation of a building having a concrete bottom plate 101 and a standing wall part 103, has an adhesive material 3 arranged on a boundary face 101a on the bottom plate 101, and a cylindrical member 2 fixed to an upper face of the adhesive material 3 and penetrating through the standing wall part 103 in the thickness direction.SELECTED DRAWING: Figure 7
【課題】建物の基礎に敷設される配管や配線の長さを短くするとともに、敷設時の手間を減らし、さらに配管や配線にかかる負荷を軽減する。【解決手段】コンクリート製の底盤101及び立ち上がり壁部103を有する建物の基礎に敷設する配管200を通す貫通孔10を形成するための基礎貫通部材1は、底盤101における界面101aに配設される粘着材3と、粘着材3の上面に固着され、立ち上がり壁部103を厚み方向に貫通する筒状部材2とを備えている。【選択図】図7
INSTALLATION METHOD FOR PIPING AND WIRING
To provide an installation method for piping and wiring reduced in length of piping and wiring installed on the foundation of a building, in labor for installation, and reduced in load applied to the piping and wiring.SOLUTION: A foundation penetration member 1 forming a through-hole 10 for passing piping 200 installed on the foundation of a building having a concrete bottom plate 101 and a standing wall part 103, has an adhesive material 3 arranged on a boundary face 101a on the bottom plate 101, and a cylindrical member 2 fixed to an upper face of the adhesive material 3 and penetrating through the standing wall part 103 in the thickness direction.SELECTED DRAWING: Figure 7
【課題】建物の基礎に敷設される配管や配線の長さを短くするとともに、敷設時の手間を減らし、さらに配管や配線にかかる負荷を軽減する。【解決手段】コンクリート製の底盤101及び立ち上がり壁部103を有する建物の基礎に敷設する配管200を通す貫通孔10を形成するための基礎貫通部材1は、底盤101における界面101aに配設される粘着材3と、粘着材3の上面に固着され、立ち上がり壁部103を厚み方向に貫通する筒状部材2とを備えている。【選択図】図7
INSTALLATION METHOD FOR PIPING AND WIRING
配管または配線の敷設方法
YAMAZAKI KAZUTOSHI (author) / KAWAKAMI TAKASHI (author) / ANO NATSUKI (author) / INAGAKI HIKARI (author)
2022-09-30
Patent
Electronic Resource
Japanese
IPC:
E02D
FOUNDATIONS
,
Gründungen
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