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COPPER/CERAMIC BONDED BODY, INSULATED CIRCUIT BOARD, METHOD FOR MANUFACTURING COPPER/CERAMIC BONDED BODY, AND MANUFACTURING METHOD OF INSULATED CIRCUIT BOARD
To provide a copper/ceramic bonded body superior in thermal cycle reliability by suppressing the occurrence of cracks in ceramic members, even when being subjected to a severe cooling/heating cycle.SOLUTION: In a copper/ceramic bonded body 10 composed of a copper member 12, 13 made of copper or a copper alloy, and a ceramic member 11 joined together; at the bonding interface between the ceramic member 11 and the copper members 12, 13, an active metal compound layer 21 is formed on the ceramic member 11. In the area from the active metal compound layer 21 to the copper members 12, 13 side up to 10 μm, the area ratio of active metal carbide is 8% or less.SELECTED DRAWING: Figure 2
【課題】厳しい冷熱サイクルを負荷した場合であっても、セラミックス部材における割れの発生を抑制でき、冷熱サイクル信頼性に優れた銅／セラミックス接合体を提供する。【解決手段】銅又は銅合金からなる銅部材１２，１３と、セラミックス部材１１とが接合されてなる銅／セラミックス接合体１０であって、セラミックス部材１１と銅部材１２，１３との接合界面において、セラミックス部材１１側には活性金属化合物層２１が形成されており、活性金属化合物層２１から銅部材１２，１３側へ１０μｍまでの領域における活性金属炭化物の面積率が８％以下とされていることを特徴とする。【選択図】図２
COPPER/CERAMIC BONDED BODY, INSULATED CIRCUIT BOARD, METHOD FOR MANUFACTURING COPPER/CERAMIC BONDED BODY, AND MANUFACTURING METHOD OF INSULATED CIRCUIT BOARD
To provide a copper/ceramic bonded body superior in thermal cycle reliability by suppressing the occurrence of cracks in ceramic members, even when being subjected to a severe cooling/heating cycle.SOLUTION: In a copper/ceramic bonded body 10 composed of a copper member 12, 13 made of copper or a copper alloy, and a ceramic member 11 joined together; at the bonding interface between the ceramic member 11 and the copper members 12, 13, an active metal compound layer 21 is formed on the ceramic member 11. In the area from the active metal compound layer 21 to the copper members 12, 13 side up to 10 μm, the area ratio of active metal carbide is 8% or less.SELECTED DRAWING: Figure 2
【課題】厳しい冷熱サイクルを負荷した場合であっても、セラミックス部材における割れの発生を抑制でき、冷熱サイクル信頼性に優れた銅／セラミックス接合体を提供する。【解決手段】銅又は銅合金からなる銅部材１２，１３と、セラミックス部材１１とが接合されてなる銅／セラミックス接合体１０であって、セラミックス部材１１と銅部材１２，１３との接合界面において、セラミックス部材１１側には活性金属化合物層２１が形成されており、活性金属化合物層２１から銅部材１２，１３側へ１０μｍまでの領域における活性金属炭化物の面積率が８％以下とされていることを特徴とする。【選択図】図２
COPPER/CERAMIC BONDED BODY, INSULATED CIRCUIT BOARD, METHOD FOR MANUFACTURING COPPER/CERAMIC BONDED BODY, AND MANUFACTURING METHOD OF INSULATED CIRCUIT BOARD
銅／セラミックス接合体、絶縁回路基板、および、銅／セラミックス接合体の製造方法、絶縁回路基板の製造方法
TERASAKI NOBUYUKI (author) / SAKURAI AKIRA (author)
2023-01-26
Patent
Electronic Resource
Japanese
| European Patent Office | 2020
| European Patent Office | 2022
| European Patent Office | 2022
| European Patent Office | 2020
| European Patent Office | 2022