A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
COPPER CERAMIC BONDED BODY, BRAZING FILLER METAL, AND METHOD FOR PRODUCING COPPER CERAMIC BONDED BODY
To provide a copper ceramic bonded body that has high bonding strength.SOLUTION: A copper ceramic bonded body 100 includes a copper material 10 made of Cu or a Cu alloy, a ceramic material 20 bonded to the copper material and made of a nitride of Si or Al, and a bonding layer 30 formed on the bonding surfaces 10s and 20s between the copper material and the ceramic material, containing Cu and Mg, and further containing at least one active metal element selected from the group consisting of Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Ca, Y, Ce, La, Sm, Yb, Nd, Gd and Er. The bonding layer includes a first layer 31 constituting an interface with the copper material, and including a solid solution phase 31A formed by solidly dissolving Mg in Cu and a compound phase 31B containing the intermetallic compound between Cu and Mg, and a second layer 32 constituting the interface with the ceramic material and containing a nitride of an active metal element.SELECTED DRAWING: Figure 1
【課題】高い接合強度を有する銅セラミックス接合体を提供する。【解決手段】銅セラミックス接合体１００は、ＣｕまたはＣｕ合金からなる銅材１０と、銅材に接合され、ＳｉまたはＡｌの窒化物からなるセラミックス材２０と、銅材とセラミックス材との接合面１０ｓ、２０ｓに形成され、Ｃｕと、Ｍｇと、を含み、Ｔｉ，Ｚｒ，Ｈｆ，Ｖ，Ｎｂ，Ｔａ，Ｃｒ，Ｍｏ，Ｗ，Ｃａ，Ｙ，Ｃｅ，Ｌａ，Ｓｍ，Ｙｂ，Ｎｄ，Ｇｄ，Ｅｒからなる群より選択される少なくとも一種の活性金属元素をさらに含む接合層３０と、を有し、接合層が、銅材との界面を構成し、ＣｕにＭｇが固溶してなる固溶相３１Ａと、ＣｕとＭｇとの金属間化合物を含む化合物相３１Ｂと、をそれぞれ含む第１層３１と、セラミックス材との界面を構成し、活性金属元素の窒化物を含む第２層３２と、を有する。【選択図】図１
COPPER CERAMIC BONDED BODY, BRAZING FILLER METAL, AND METHOD FOR PRODUCING COPPER CERAMIC BONDED BODY
To provide a copper ceramic bonded body that has high bonding strength.SOLUTION: A copper ceramic bonded body 100 includes a copper material 10 made of Cu or a Cu alloy, a ceramic material 20 bonded to the copper material and made of a nitride of Si or Al, and a bonding layer 30 formed on the bonding surfaces 10s and 20s between the copper material and the ceramic material, containing Cu and Mg, and further containing at least one active metal element selected from the group consisting of Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Ca, Y, Ce, La, Sm, Yb, Nd, Gd and Er. The bonding layer includes a first layer 31 constituting an interface with the copper material, and including a solid solution phase 31A formed by solidly dissolving Mg in Cu and a compound phase 31B containing the intermetallic compound between Cu and Mg, and a second layer 32 constituting the interface with the ceramic material and containing a nitride of an active metal element.SELECTED DRAWING: Figure 1
【課題】高い接合強度を有する銅セラミックス接合体を提供する。【解決手段】銅セラミックス接合体１００は、ＣｕまたはＣｕ合金からなる銅材１０と、銅材に接合され、ＳｉまたはＡｌの窒化物からなるセラミックス材２０と、銅材とセラミックス材との接合面１０ｓ、２０ｓに形成され、Ｃｕと、Ｍｇと、を含み、Ｔｉ，Ｚｒ，Ｈｆ，Ｖ，Ｎｂ，Ｔａ，Ｃｒ，Ｍｏ，Ｗ，Ｃａ，Ｙ，Ｃｅ，Ｌａ，Ｓｍ，Ｙｂ，Ｎｄ，Ｇｄ，Ｅｒからなる群より選択される少なくとも一種の活性金属元素をさらに含む接合層３０と、を有し、接合層が、銅材との界面を構成し、ＣｕにＭｇが固溶してなる固溶相３１Ａと、ＣｕとＭｇとの金属間化合物を含む化合物相３１Ｂと、をそれぞれ含む第１層３１と、セラミックス材との界面を構成し、活性金属元素の窒化物を含む第２層３２と、を有する。【選択図】図１
COPPER CERAMIC BONDED BODY, BRAZING FILLER METAL, AND METHOD FOR PRODUCING COPPER CERAMIC BONDED BODY
銅セラミックス接合体、ろう材、および、銅セラミックス接合体の製造方法
NOKAWA GENYA (author) / TAKANO SHUN (author) / OKISHIRO KENJI (author) / OKAMOTO ATSUSHI (author)
2023-10-05
Patent
Electronic Resource
Japanese
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