A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
CERAMIC SUBSTRATE AND CERAMIC DIVIDED SUBSTRATE
To provide a ceramic substrate and a ceramic divided substrate which can suppress warpage even when either one of a radiation sheet and a circuit board is made thick.SOLUTION: In a ceramic substrate 1 that includes: an insulating base material 2 made of a flat ceramic; a first brazing material layer 31 provided on a first main surface 2a of the insulating base material; a second brazing material layer 32 provided on a second main surface 2b of the insulating base material; a circuit board 41 formed from metal, which is fixed on the first main surface side of the insulating base material via the first brazing material layer; and a radiation sheet 42 formed from metal, which is fixed on the second main surface side of the insulating base material via the second brazing material layer, a thickness of either one of the radiation sheet and the circuit board is thicker than a thickness of the other; and when a thickness of the radiation sheet is thicker than a thickness of the circuit board, a thickness of the first brazing material layer is made thicker than a thickness of the second brazing material layer, and when the thickness of the circuit board is thicker than the thickness of the radiation sheet, the thickness of the second brazing material layer is made thicker than the thickness of the first brazing material layer.SELECTED DRAWING: Figure 1
【課題】放熱板および回路板のいずれか一方を厚くしても反りを抑制することが可能なセラミックス基板及びセラミックス分割基板を提供する。【解決手段】平板状のセラミックスからなる絶縁基材２と、絶縁基材の第１の主面２ａに設けられた第１のろう材層３１と、絶縁基材の第２の主面２ｂに設けられた第２のろう材層３２と、第１のろう材層を介して絶縁基材の第１の主面側に固定された金属からなる回路板４１と、第２のろう材層を介して絶縁基材の第２の主面側に固定された金属からなる放熱板４２とを備えるセラミックス基板１において、放熱板および回路板は、いずれか一方の厚みが他方の厚みよりも厚く、放熱板の厚みが回路板の厚みよりも厚い場合には、第１のろう材層の厚みが第２のろう材層よりも厚く、回路板の厚みが放熱板の厚みよりも厚い場合には、第２のろう材層の厚みを第１のろう材層よりも厚くする。【選択図】図１
CERAMIC SUBSTRATE AND CERAMIC DIVIDED SUBSTRATE
To provide a ceramic substrate and a ceramic divided substrate which can suppress warpage even when either one of a radiation sheet and a circuit board is made thick.SOLUTION: In a ceramic substrate 1 that includes: an insulating base material 2 made of a flat ceramic; a first brazing material layer 31 provided on a first main surface 2a of the insulating base material; a second brazing material layer 32 provided on a second main surface 2b of the insulating base material; a circuit board 41 formed from metal, which is fixed on the first main surface side of the insulating base material via the first brazing material layer; and a radiation sheet 42 formed from metal, which is fixed on the second main surface side of the insulating base material via the second brazing material layer, a thickness of either one of the radiation sheet and the circuit board is thicker than a thickness of the other; and when a thickness of the radiation sheet is thicker than a thickness of the circuit board, a thickness of the first brazing material layer is made thicker than a thickness of the second brazing material layer, and when the thickness of the circuit board is thicker than the thickness of the radiation sheet, the thickness of the second brazing material layer is made thicker than the thickness of the first brazing material layer.SELECTED DRAWING: Figure 1
【課題】放熱板および回路板のいずれか一方を厚くしても反りを抑制することが可能なセラミックス基板及びセラミックス分割基板を提供する。【解決手段】平板状のセラミックスからなる絶縁基材２と、絶縁基材の第１の主面２ａに設けられた第１のろう材層３１と、絶縁基材の第２の主面２ｂに設けられた第２のろう材層３２と、第１のろう材層を介して絶縁基材の第１の主面側に固定された金属からなる回路板４１と、第２のろう材層を介して絶縁基材の第２の主面側に固定された金属からなる放熱板４２とを備えるセラミックス基板１において、放熱板および回路板は、いずれか一方の厚みが他方の厚みよりも厚く、放熱板の厚みが回路板の厚みよりも厚い場合には、第１のろう材層の厚みが第２のろう材層よりも厚く、回路板の厚みが放熱板の厚みよりも厚い場合には、第２のろう材層の厚みを第１のろう材層よりも厚くする。【選択図】図１
CERAMIC SUBSTRATE AND CERAMIC DIVIDED SUBSTRATE
セラミックス基板及びセラミックス分割基板
OMORI TERUYUKI (author)
2023-10-12
Patent
Electronic Resource
Japanese
CERAMIC SUBSTRATE, CERAMIC DIVIDED SUBSTRATE, AND METHOD FOR MANUFACTURING CERAMIC SUBSTRATE
| European Patent Office | 2023
CERAMIC SUBSTRATE, CERAMIC DIVIDED SUBSTRATE, AND METHOD FOR MANUFACTURING CERAMIC SUBSTRATE
| European Patent Office | 2023
Ceramic substrate processing method and ceramic substrate
| European Patent Office | 2024
European Patent Office | 2020