A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
HEAT INSULATION METHOD OF ARCHITECTURAL STRUCTURE, HEAT INSULATION STRUCTURE OF ARCHITECTURAL STRUCTURE, ADHESIVE AND SURFACE PROTECTIVE MATERIAL
To avoid a deterioration of strength of insulation material.SOLUTION: The heat insulation method of an architectural structure comprises the steps for: fixing insulation material to a surface of a wall substrate provided at the architectural structure; and forming a surface protective layer on a surface of the insulation material. The surface protective layer is formed by a surface protective material having pH equal to or less than 10. Further, the heat insulation structure overlapped on the wall substrate of the architectural structure comprises a heat insulation layer and the surface protective layer in this order from the wall substrate side, the surface protective layer consisting of material having pH equal to or less than 10.SELECTED DRAWING: Figure 1
【課題】断熱材の強度低下を回避することを目的とする。【解決手段】建築物の断熱工法は、建築物に備えられる壁下地の表面に断熱材を固定する工程と、前記断熱材の表面に表面保護層を形成する工程と、を備え、前記表面保護層がｐＨ１０以下の表面保護材により形成されている。また、建築物の壁下地に重ねられる建築物の断熱構造は、断熱層と、表面保護層とを、前記壁下地側からこの順に備え、前記表面保護層が、ｐＨ１０以下の材料により構成されている。【選択図】図１
HEAT INSULATION METHOD OF ARCHITECTURAL STRUCTURE, HEAT INSULATION STRUCTURE OF ARCHITECTURAL STRUCTURE, ADHESIVE AND SURFACE PROTECTIVE MATERIAL
To avoid a deterioration of strength of insulation material.SOLUTION: The heat insulation method of an architectural structure comprises the steps for: fixing insulation material to a surface of a wall substrate provided at the architectural structure; and forming a surface protective layer on a surface of the insulation material. The surface protective layer is formed by a surface protective material having pH equal to or less than 10. Further, the heat insulation structure overlapped on the wall substrate of the architectural structure comprises a heat insulation layer and the surface protective layer in this order from the wall substrate side, the surface protective layer consisting of material having pH equal to or less than 10.SELECTED DRAWING: Figure 1
【課題】断熱材の強度低下を回避することを目的とする。【解決手段】建築物の断熱工法は、建築物に備えられる壁下地の表面に断熱材を固定する工程と、前記断熱材の表面に表面保護層を形成する工程と、を備え、前記表面保護層がｐＨ１０以下の表面保護材により形成されている。また、建築物の壁下地に重ねられる建築物の断熱構造は、断熱層と、表面保護層とを、前記壁下地側からこの順に備え、前記表面保護層が、ｐＨ１０以下の材料により構成されている。【選択図】図１
HEAT INSULATION METHOD OF ARCHITECTURAL STRUCTURE, HEAT INSULATION STRUCTURE OF ARCHITECTURAL STRUCTURE, ADHESIVE AND SURFACE PROTECTIVE MATERIAL
建築物の断熱工法、建築物の断熱構造、接着剤、および表面保護材
HATTORI EMI (author) / KITAGAWA DAISUKE (author) / KATO KEIICHI (author)
2024-05-24
Patent
Electronic Resource
Japanese
IPC:
E04B
Allgemeine Baukonstruktionen
,
GENERAL BUILDING CONSTRUCTIONS
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