A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
FLOOR CONSTRUCTION STRUCTURE OF BUILDING WITH EXCELLENT SOUND INSULATION EFFECT
The present invention relates to a building floor construction structure modified (improved) from Korea patent application No. 10-2015-0178009 (application date: December 14, 2015) presented by the present applicant; wherein an interlayer sound insulation effect or the like is improved, and excellent efficiency of heating is ensured by means of a high heat transferring function, insulation, and the like. The building floor construction structure comprises: a floor structure; a shock buffering unit installed in the floor structure; a support unit installed in the shock buffering unit; a heating panel installed in the support unit; and a heating pipe installed in the heating panel. The heating panel comprises: an insulation material installed in the support unit; and a thermally conductive panel installed in the insulation material. Here, the floor structure has an insertion hole formed therein, and a bottom of the shock buffering unit is inserted and installed in the insertion hole. According to the present invention, excellent interlay sound insulation effect, efficiency of heating, and the like are ensured by means of an improved sound insulation structure and heating structure.
본 발명은, 본 출원인이 제시한 대한민국 특허출원 제10-2015-0178009호(출원일 : 2015년 12월 14일)를 개량(개선)하여 층간 차음성 등이 향상되고 이와 함께 높은 열전달능과 단열성 등에 의해 우수한 난방 효율을 가지는 건축물의 바닥 시공구조에 관한 것이다. 본 발명은 바닥 구조체; 상기 바닥 구조체 상에 설치된 충격 완충 유닛; 상기 충격 완충 유닛 상에 설치된 지지 유닛; 상기 지지 유닛 상에 설치된 난방 패널; 및 상기 난방 패널에 설치된 난방 배관을 포함하고, 상기 난방 패널은 지지 유닛 상에 설치된 단열재와, 상기 단열재 상에 설치된 열전도성 패널을 포함한다. 이때, 상기 바닥 구조체에는 삽입홀이 형성되고, 상기 삽입홀에는 충격 완충 유닛의 하측이 삽입되어 설치된다. 본 발명에 따르면, 개선된 차음구조 및 난방구조에 의해 우수한 층간 차음성과 난방 효율 등을 갖는다.
FLOOR CONSTRUCTION STRUCTURE OF BUILDING WITH EXCELLENT SOUND INSULATION EFFECT
The present invention relates to a building floor construction structure modified (improved) from Korea patent application No. 10-2015-0178009 (application date: December 14, 2015) presented by the present applicant; wherein an interlayer sound insulation effect or the like is improved, and excellent efficiency of heating is ensured by means of a high heat transferring function, insulation, and the like. The building floor construction structure comprises: a floor structure; a shock buffering unit installed in the floor structure; a support unit installed in the shock buffering unit; a heating panel installed in the support unit; and a heating pipe installed in the heating panel. The heating panel comprises: an insulation material installed in the support unit; and a thermally conductive panel installed in the insulation material. Here, the floor structure has an insertion hole formed therein, and a bottom of the shock buffering unit is inserted and installed in the insertion hole. According to the present invention, excellent interlay sound insulation effect, efficiency of heating, and the like are ensured by means of an improved sound insulation structure and heating structure.
본 발명은, 본 출원인이 제시한 대한민국 특허출원 제10-2015-0178009호(출원일 : 2015년 12월 14일)를 개량(개선)하여 층간 차음성 등이 향상되고 이와 함께 높은 열전달능과 단열성 등에 의해 우수한 난방 효율을 가지는 건축물의 바닥 시공구조에 관한 것이다. 본 발명은 바닥 구조체; 상기 바닥 구조체 상에 설치된 충격 완충 유닛; 상기 충격 완충 유닛 상에 설치된 지지 유닛; 상기 지지 유닛 상에 설치된 난방 패널; 및 상기 난방 패널에 설치된 난방 배관을 포함하고, 상기 난방 패널은 지지 유닛 상에 설치된 단열재와, 상기 단열재 상에 설치된 열전도성 패널을 포함한다. 이때, 상기 바닥 구조체에는 삽입홀이 형성되고, 상기 삽입홀에는 충격 완충 유닛의 하측이 삽입되어 설치된다. 본 발명에 따르면, 개선된 차음구조 및 난방구조에 의해 우수한 층간 차음성과 난방 효율 등을 갖는다.
FLOOR CONSTRUCTION STRUCTURE OF BUILDING WITH EXCELLENT SOUND INSULATION EFFECT
우수한 층간 차음성을 가지는 건축물의 바닥 시공구조
AN SEUNG HAN (author)
2017-08-17
Patent
Electronic Resource
Korean
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